Journal of Institute of Control, Robotics and Systems (제어로봇시스템학회논문지)

Institute of Control, Robotics and Systems (제어로봇시스템학회)
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Pattern Partitioning and Decision Method in the Semiconductor Chip Marking Inspection

반도체 부품 마크 미세 결함 검사를 위한 패턴 영역 분할 및 인식 방법

  • 장유정 (호서대학교 디지털디스플레이공학과) ;
  • 이정섭 (호서대학교 디지털디스플레이공학과) ;
  • 주효남 (호서대학교 디지털디스플레이공학과) ;
  • 김준식 (호서대학교 전자공학과)
  • Received : 2010.01.28
  • Accepted : 2010.07.04
  • Published : 2010.09.01
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Abstract

To inspect the defects of printed markings on the surface of IC package, the OCV (Optical Character Verification) method based on NCC (Normalized Correlation Coefficient) pattern matching is widely used. In order to detect the micro pattern defects appearing on the small portion of the markings, a Partitioned NCC pattern matching method was proposed to overcome the limitation of the NCC pattern matching. In this method, the reference pattern is first partitioned into several blocks and the NCC values are computed and are combined in these small partitioned blocks, rather than just using the NCC value for the whole reference pattern. In this paper, we proposed a method to decide the proper number of partition blocks and a method to inspect and combine the NCC values of each partitioned block to identify the defective markings.

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References

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