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A study on improving the surface morphology of recycled wafer forsolar cells using micro_blaster

Micro blaster를 이용한 태양전지용 재생웨이퍼의 표면 개선에 관한 연구

  • Lee, Youn-Ho (School of Electrical Engineering and Computer Science, Kyungpook National University) ;
  • Jo, Jun-Hwan (School of Electrical Engineering and Computer Science, Kyungpook National University) ;
  • Kim, Sang-Won (School of Electrical Engineering and Computer Science, Kyungpook National University) ;
  • Kong, Dae-Young (School of Electrical Engineering and Computer Science, Kyungpook National University) ;
  • Seo, Chang-Taeg (School of Electrical Engineering and Computer Science, Kyungpook National University) ;
  • Cho, Chan-Seob (School of Electrical Engineering, Kyungpook National University) ;
  • Lee, Jong-Hyun (School of Electrical Engineering and Computer Science, Kyungpook National University)
  • 이윤호 (경북대학교 전자전기컴퓨터학부) ;
  • 조준환 (경북대학교 전자전기컴퓨터학부) ;
  • 김상원 (경북대학교 전자전기컴퓨터학부) ;
  • 공대영 (경북대학교 전자전기컴퓨터학부) ;
  • 서창택 (경북대학교 전자전기컴퓨터학부) ;
  • 조찬섭 (경북대학교 산업전자전기공학부) ;
  • 이종현 (경북대학교 전자전기컴퓨터학부)
  • Received : 2010.04.20
  • Accepted : 2010.06.14
  • Published : 2010.07.31

Abstract

Recently, recycling method of waste wafer has been an area of solar cell to cut costs. Micro_blasting is one of the promising candidates for recycling of waste wafer due to their extremely simple and cost-effective process. In this paper, we attempt to explore the effect of micro_blasting and DRE(damage removal etching) process for solar cell. The optimal process conditions of micro_blasting are as follows: $10{\mu}m$ sized $Al_2O_3$ powder, jetting pressure of 400 kPa, and scan_speed of 30 cm/s. And the particles formed on micro_blasted wafer were removed by DRE precess which was performed by using HNA(HF/$HNO_3$/$CH_3COOH$) and TMAH(tetramethyl ammonium hydroxide). Structural analysis was done using a-step and the XRD patterns.

Keywords

References

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