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Preparation of silver stabilizer layer on coated conductor by continuous dip coating method using organic silver complexes

유기 은 착체 화합물을 코팅용액으로 사용하여 연속적인 담금코팅방법에 의한 은 안정화층 제조

  • 이종범 (한국산업기술대학교 에너지대학원) ;
  • 김지철 (한국산업기술대학교 에너지대학원) ;
  • 박신근 (한국산업기술대학교 에너지대학원) ;
  • 김병주 (한국산업기술대학교 에너지대학원) ;
  • 김재근 (한국산업기술대학교 에너지대학원) ;
  • 이희균 (한국산업기술대학교 신소재공학과) ;
  • 홍계원 (한국산업기술대학교 신소재공학과)
  • Published : 2010.03.31

Abstract

Silver stabilizing layer of coated conductor has been prepared by dip coating method using organic silver complexes containing 10 wt% silver as a starting material. Coated silver complex layer was dried in situ with hot air and converted to crystalline silver by post heat treatment in flowing oxygen atmosphere. A dense continuous silver layer with good surface coverage and proper thickness of 230 nm is obtained by multiple dip coatings and heat treatments. The film heat treated at $500^{\circ}C$ showed good mechanical adhesion and crystallographic property. The interface resistivity between superconducting YBCO layer and silver layer prepared by dip coating was measured as $0.67\;{\times}\;10^{-13}\;{\Omega}m^2$. Additional protecting copper layer with the thickness of $20\;{\mu}m$ was successfully deposited by electroplating. The critical current measured with the specimen prepared by dip coating and sputtering on same quality YBCO layer showed similar value of ~140 A and proved its ability to replace sputtering method for industrial production of coated conductor.

Keywords

References

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