한국표면공학회지 (Journal of the Korean institute of surface engineering)

  • 제43권2호
  • /
  • Pages.111-120
  • /
  • 2010
  • /
  • 1225-8024(pISSN)
  • /
  • 2288-8403(eISSN)
한국표면공학회 (The Korean Institute of Surface Engineering)
권호 표지
DOI QR코드

DOI QR Code

복합 착화제 첨가가 무전해 Ni-P 도금액의 특성에 미치는 영향

Effects of Multi-Complex Agent Addition on Characteristics of Electroless Ni-P Solution

  • 이홍기 (한국 생산기술연구원 인천기술지원본부 열표면기술지원센터) ;
  • 이호년 (한국 생산기술연구원 인천기술지원본부 열표면기술지원센터) ;
  • 전준미 (한국 생산기술연구원 인천기술지원본부 열표면기술지원센터) ;
  • 허진영 (한국 생산기술연구원 인천기술지원본부 열표면기술지원센터)
  • Lee, Hong-Kee (Incheon Technology Service Division and Heat Treatment & Plating Technology Service Center, Korea Institute of Industrial Technology) ;
  • Lee, Ho-Nyun (Incheon Technology Service Division and Heat Treatment & Plating Technology Service Center, Korea Institute of Industrial Technology) ;
  • Jeon, Jun-Mi (Incheon Technology Service Division and Heat Treatment & Plating Technology Service Center, Korea Institute of Industrial Technology) ;
  • Hur, Jin-Young (Incheon Technology Service Division and Heat Treatment & Plating Technology Service Center, Korea Institute of Industrial Technology)
  • 투고 : 2010.03.22
  • 심사 : 2010.04.29
  • 발행 : 2010.04.30
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

In this study, the effects of multi-complex agents addition on characteristics of electroless Ni plating solution are investigated. The species and the concentration of complexing agents are major factors to control the deposition rate, P concentration, and surface morphology of plating films. Adipic acid increases the deposition rate in regardless of single- or mutli-complex agent addition. However, lactic acid effectively increases the deposition rate in case of multi-addition as the complex agents with adipic or sodium succinate acid. In addition, sodium citric acid and malic acid show good stabilizing effects of plating solution and lowering the deposition rate, because they have high complexibility. Therefore, it is suggested that the development of Ni-P plating solution suitable for diverse usages can be carried out systematically using the database from this study.

키워드

참고문헌

  1. T. K. Tsai, C. Guang, Appl. Surf. Sci., 233 (2004) 180. https://doi.org/10.1016/j.apsusc.2004.03.014
  2. M. Yan, H. G. Ying, T. Y. Ma, Surf. Coat. Technol., 202 (2008) 5909. https://doi.org/10.1016/j.surfcoat.2008.06.180
  3. Y. Gao, L. Huang, Z. J. Zheng, H. Li, M. Zhu, Appl. Surf. Sci., 253 (2007) 9470. https://doi.org/10.1016/j.apsusc.2007.06.010
  4. R. Elansezhiana, B. Ramamoorthy, P. Kesavan Nair, J. Mater Process Technol., 209 (2009) 233. https://doi.org/10.1016/j.jmatprotec.2008.01.057
  5. J. T. Winowlin Jappes, B. Ramamoorty, P. K. Nair, J. Mater Process Technol., 169 (2005) 308. https://doi.org/10.1016/j.jmatprotec.2005.03.010
  6. M. Crobu, Andrea Scorciapino, Bernhard Elsener, Antonella Rossi, Electrochim. Acta, 53 (2008) 3364. https://doi.org/10.1016/j.electacta.2007.11.071
  7. Y. S. Huang, F. Z. Cui, Surf. Coat. Technol., 201 (2007) 5416. https://doi.org/10.1016/j.surfcoat.2006.07.189
  8. M. Palaniappa, S. K. Seshadri, Mater. Sci. Eng., A 460-461 (2007) 638. https://doi.org/10.1016/j.msea.2007.01.134
  9. R. Tarozaite, O. Gyliene, G. Stalnionis, Surf. Coat. Technol., 200 (2005) 2208. https://doi.org/10.1016/j.surfcoat.2004.07.099
  10. G. O. Malloy, J. B. Hajdu, Electroless Plating, Fundamentals and Applications, (1990) 57.
  11. R. Elansezhian, B. Ramamoorthy, P. Kesavan Nair, Surf. Coat. Technol., 203 (2008) 709. https://doi.org/10.1016/j.surfcoat.2008.08.021
  12. Y. S. Huang, F. Z. Cui, Surf. Coat. Technol., 201 (2007) 5416. https://doi.org/10.1016/j.surfcoat.2006.07.189
  13. J. R. Henry, Met. Finish., 97 (1999) 431. https://doi.org/10.1016/S0026-0576(99)80044-0
  14. J. Li, Z. Shao, X. Zhang, Y. Tian, Surf. Coat. Technol., 200 (2006) 3010. https://doi.org/10.1016/j.surfcoat.2004.12.009