Journal of Surface Science and Engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Comparison of Acidic and Alkaline Bath in Electroless Nickel Plating on Porous Carbon Substrate

다공성 탄소전극상 무전해 니켈도금의 산성과 알칼리용액 비교 연구

  • Chun, So-Young (Dept. of Materials Science and Engineering, Hongik University) ;
  • Kang, In-Seok (Dept. of Materials Science and Engineering, Hongik University) ;
  • Rhym, Young-Mok (Dept. of Materials Test and Characterization Group, Korea Institute of Materials Science) ;
  • Kim, Doo-Hyun (Dept. of Materials Test and Characterization Group, Korea Institute of Materials Science) ;
  • Lee, Jae-Ho (Dept. of Materials Science and Engineering, Hongik University)
  • 천소영 (홍익대학교 신소재공학과) ;
  • 강인석 (홍익대학교 신소재공학과) ;
  • 임영목 (한국재료연구소 재료특성평가그룹) ;
  • 김두현 (한국재료연구소 재료특성평가그룹) ;
  • 이재호 (홍익대학교 신소재공학과)
  • Received : 2010.04.12
  • Accepted : 2010.04.26
  • Published : 2010.04.30
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Abstract

Electroless nickel plating on porous carbon substrate for the application of MCFC electrodes was investigated. Acidic and alkaline bath were used for the electroless nickel plating. The pore sizes of carbon substrates were 16-20 ${\mu}m$ and over 20 ${\mu}m$. The carbon surface was changed from hydrophobic to hydrophilic after immersing the substrate in an ammonia solution for 40 min at $60^{\circ}C$. The contact angle of water was decreased from $85^{\circ}C$ to less than $20^{\circ}$ after ammonia pretreatment. The deposition rate in the alkaline bath was higher than that in the acidic bath. The deposition rate was increased with increasing pH in both acidic and alkaline bath. The content of phosphorous in nickel deposit was decreased with increasing pH in both acidic and alkaline bath. The contents of phosphorous is low in alkaline bath. The minimum concentration of $PdCl_2$ for the electroless nickel plating was 10 ppm in alkaline bath and 5 ppm in acidic bath. The thickness of nickel was not affected by the concentration of $PdCl_2$.

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