DOI QR코드

DOI QR Code

Dependence of Device Performance and Reliability on Channel Direction in PMOSFET's

PMOSFET에서 채널 방향에 대한 소자 성능 의존성

  • Bok, Jung-Deuk (Department of Electronics Engineering, Chungnam National University) ;
  • Park, Ye-Ji (Department of Electronics Engineering, Chungnam National University) ;
  • Han, In-Shik (Department of Electronics Engineering, Chungnam National University) ;
  • Kwon, Hyuk-Min (Department of Electronics Engineering, Chungnam National University) ;
  • Park, Byoung-Seok (Department of Electronics Engineering, Chungnam National University) ;
  • Park, Sang-Uk (Department of Electronics Engineering, Chungnam National University) ;
  • Lim, Min-Gyu (SMS, MagnaChip Semiconductor) ;
  • Chung, Yi-Sun (SMS, MagnaChip Semiconductor) ;
  • Lee, Jung-Hwan (SMS, MagnaChip Semiconductor) ;
  • Lee, Hi-Deok (Department of Electronics Engineering, Chungnam National University)
  • 복정득 (충남대학교 전자전파정보통신공학부) ;
  • 박예지 (충남대학교 전자전파정보통신공학부) ;
  • 한인식 (충남대학교 전자전파정보통신공학부) ;
  • 권혁민 (충남대학교 전자전파정보통신공학부) ;
  • 박병석 (충남대학교 전자전파정보통신공학부) ;
  • 박상욱 (충남대학교 전자전파정보통신공학부) ;
  • 임민규 (매그나칩반도체 SMS) ;
  • 정의선 (매그나칩반도체 SMS) ;
  • 이정환 (매그나칩반도체 SMS) ;
  • 이희덕 (충남대학교 전자전파정보통신공학부)
  • Received : 2010.02.23
  • Accepted : 2010.05.23
  • Published : 2010.06.01

Abstract

In this paper, we investigated the dependence of device performance and hot carrier lifetime on the channel direction of PMOSFET. $I_{D.sat}$ vs. $I_{Off}$ characteristic of PMOSFET with <100> channel direction is greater than that with <110> channel direction because carrier mobility of <100> channel direction is greater than that of <110> channel direction. However, hot carrier lifetime for <110> channel direction is much lower than that with <110> channel due to the greater impact ionization rate in the <100> channel direction. Therefore, concurrent consideration of reliability characteristics and device performance is necessary for channel strain engineering of MOSFETs.

Keywords

References

  1. M. T. Currie, International Conference on Integrated Circuit Design and Technology(ICICDT) (2004) p. 261.
  2. T. Ghani, M. Armstrong, C. Auth. M. Bost. P.Charvat, G. Glass, T. Hoffmann.. K. Johnson. C. Kenyon. J. Klaus, B. Mclntyre. K. MisQ. A. Murthy, J. Sandford, M. Siiberstein, S. Sivakumar. P. Smith, K. Zawadski. S. Thompson and M. Bohr, IEDM Tech. Dig. (2003) p. 297.
  3. P. Bai, C. Auth, S. Balakrishnan, M. Bost, R. Brain, V. Chikarmane, R. Heussner, M. Hussein, J. Hwang, D. Ingerly, R. James, I. Jeong, C. Kenyan, E. Lee, S-H. Lee, N. Lindert, M. Liu, Z. Ma, T. Marieb’, A. Murthy, R. Nagisetty, S. Natarajan, J. Neirynck, A. Ott, C. Parker, J. Sebastian, R. Shaheed, S. Sivakumar, J. Steigenvald, S. Tyagi, C. Weber, B. Woolely, A. Yeoh, K. Zhang, and M. Bohr, IEDM Tech. Dig. (2004) p. 657.
  4. S. Ito, H. Namba, K. Yamaguchi, T. Hirata, K. Ando, S. Koyama, S. Kuroki, N. Ikezawa, T. Suzuki, T. Saitoh, and T. Horiuchi, IEDM Tech. Dig. (2000) p.247.
  5. G. Scott, J. Lutze, M. Rubin, F. Nouri, and M. Manley, IEDM Tech. Dig. (1999) p. 827.
  6. A. Shimizu, K. Hachimine, N. Ohki, H. Ohta, M. Koguchi, Y. Nonaka, H. Sato, and F. Ootsuka, IEDM Tech. Dig. (2001) p. 433.
  7. V. Chan, K. Rim, M. Ieong, S. Yang, R. Malik, Y. W. Teh, M. Yang, and Q. (Christine) Ouyang, Custom Integrated Circuits Conference (2005) p. 667.
  8. H. S. Momose and S. Yoshitomi, Proc. 26th International Conference on Microelectronics (2008) p. 137.
  9. M. S. Liang, J. Y. Choi, P. K. Ko, and C. Hu, IEEE Trans. Electron. Devices 33, 409 (1986). https://doi.org/10.1109/T-ED.1986.22502