Smart Structures and Systems

  • 제6권3호
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  • Pages.225-238
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  • 2010
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  • 1738-1584(pISSN)
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  • 1738-1991(eISSN)
테크노프레스 (Techno-Press)
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Fabrication and packaging techniques for the application of MEMS strain sensors to wireless crack monitoring in ageing civil infrastructures

  • Ferri, Matteo (Institute of Microelectronics and Microsystems (IMM), National Research Council of Italy) ;
  • Mancarella, Fulvio (Institute of Microelectronics and Microsystems (IMM), National Research Council of Italy) ;
  • Seshia, Ashwin (Department of Engineering, University of Cambridge) ;
  • Ransley, James (Department of Engineering, University of Cambridge) ;
  • Soga, Kenichi (Department of Engineering, University of Cambridge) ;
  • Zalesky, Jan (Czech Technical University in Prague, Faculty of Civil Engineering) ;
  • Roncaglia, Alberto (Institute of Microelectronics and Microsystems (IMM), National Research Council of Italy)
  • 투고 : 2008.07.01
  • 심사 : 2009.07.01
  • 발행 : 2010.04.25
⟨ 이전 논문 다음 논문 ⟩

초록

We report on the development of a new technology for the fabrication of Micro-Electro-Mechanical-System (MEMS) strain sensors to realize a novel type of crackmeter for health monitoring of ageing civil infrastructures. The fabrication of micromachined silicon MEMS sensors based on a Silicon On Insulator (SOI) technology, designed according to a Double Ended Tuning Fork (DETF) geometry is presented, using a novel process which includes a gap narrowing procedure suitable to fabricate sensors with low motional resistance. In order to employ these sensors for crack monitoring, techniques suited for bonding the MEMS sensors on a steel surface ensuring good strain transfer from steel to silicon and a packaging technique for the bonded sensors are proposed, conceived for realizing a low-power crackmeter for ageing infrastructure monitoring. Moreover, the design of a possible crackmeter geometry suited for detection of crack contraction and expansion with a resolution of $10{\mu}m$ and very low power consumption requirements (potentially suitable for wireless operation) is presented. In these sensors, the small crackmeter range for the first field use is related to long-term observation on existing cracks in underground tunnel test sections.

키워드

참고문헌

  1. Chen, G., McDaniel, R., Sun, S., Pommerenke, D. and Drewniak, J. (2005), "Distributed crack sensors featuring unique memory capability for post-earthquake condition assessment of RC structures", Smart Struct. Syst., 1(2), 141-158. https://doi.org/10.12989/sss.2005.1.2.141
  2. Ferri, M., Mancarella, F., Ransley, J., Yan, J., Seshia, A. and Roncaglia, A. (2008), "Fabrication of DETF sensors in SOI technology with submicron air gaps using a maskless line narrowing technique", Proceedings of IEEE Sensors 2008, Lecce, October.
  3. Forsen, E., Davis, Z.J., Dong, M., Nilsson, S.G., Montelius, L. and Boisen, A. (2004), "Dry release of suspended nanostructures", Microelectron. Eng., 73-74, 487-490. https://doi.org/10.1016/S0167-9317(04)00198-4
  4. Geokon Incorporated (2006), http://www.geokon.com/products/datasheets/gk403.pdf.
  5. Gere, J.M. and Timoshenko, S.P. (1997), Mechanics of materials, 4th Ed., PWS, International Thomson Publishing, Boston.
  6. Hautamaki, C., Cao, L., Zhou, J., Mantell, S.C. and Kim, T.S. (2003), "Calibration of MEMS strain sensors fabricated on silicon: theory and experiments", J. Microelectromech. S., 12(5), 720-727. https://doi.org/10.1109/JMEMS.2003.817887
  7. Lee, J.E.-Y., Bahreyni, B., Zhu, Y. and Seshia, A.A. (2008), "A single-crystal-silicon bulk-acoustic-mode microresonator oscillator", IEEE Electr. Device L., 29(7), 701-703. https://doi.org/10.1109/LED.2008.2000643
  8. Maxim Integrated Products(2007), http://www.maxim-ic.com/products/amp_comp/low_power/.
  9. National Semiconductor Corporation (2000), http://www.national.com/ms/CE/CERAMIC_DUAL-IN-LINE_ PACKAGE.pdf.
  10. Pisano, A. (2007), "MEMS and nano technology for the handheld, portable electronic and the automotive markets", Proceedings of the Solid-State Sensors, Actuators and Microsystems Conference, Lyon, France, June.
  11. Roach, D. (2009), "Real time crack detection using mountable comparative vacuum monitoring sensors", Smart Struct. Syst., 5(4), 317-328. https://doi.org/10.12989/sss.2009.5.4.317
  12. RS Components S.P.A. (2001), http://it.rs-online.com/web/search/searchBrowseAction.html?method=searchProducts &searchTerm=0632124&x=0&y=0.
  13. Seshia, A., Palaniapan, M., Roessig, T.A., Howe, R.T., Gooch, R.W., Schimert, T.R. and Montague, S. (2002), "A vacuum packaged surface micromachined resonant accelerometer", J. Microelectromech. S., 11(6), 784-793. https://doi.org/10.1109/JMEMS.2002.805207
  14. Sosnowchik, B.D., Azevedo, R.G., Cao, A., Lin, L.W. and Pisano, A.P. (2005), "Silicon-to-steel bonding using rapid thermal annealing", IEEE T. Adv. Packaging, 28(4), 626-634. https://doi.org/10.1109/TADVP.2005.858307
  15. Tilmans, H.A.C. (1997), "Equivalent circuit representation of electromechanical transducers: II. Distributedparameter systems", J. Micromech. Microeng., 7, 285-309. https://doi.org/10.1088/0960-1317/7/4/005
  16. Vishay Micro-Measurements (2009), http://www.vishay.com/strain-gages/list/product-11298/.
  17. Wojciechowski, K.E., Boser, B.E. and Pisano, A.P. (2004), "A MEMS resonant strain sensor operated in air", Proceedings of the 17th IEEE International Conference on. Micro Electro Mechanical Systems (MEMS), 841-845.

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  2. A socio-economic analysis of Smart Infrastructure sensor technology vol.31, 2013, https://doi.org/10.1016/j.trc.2013.02.015
  3. Geographic mapping model for underground structural deformation monitoring vol.5, pp.4, 2014, https://doi.org/10.1080/19475705.2013.812994
  4. A Hybrid Vibration Powered Microelectromechanical Strain Gauge vol.16, pp.1, 2016, https://doi.org/10.1109/JSEN.2015.2479295
  5. Infrastructure sensing vol.6, pp.4, 2016, https://doi.org/10.1098/rsfs.2016.0023
  6. Fabrication of high-resolution strain sensors based on wafer-level vacuum packaged MEMS resonators vol.239, 2016, https://doi.org/10.1016/j.sna.2016.01.006