Study on High Speed Laser Cutting of Rigid Flexible Printed Circuit Board by using UV Laser with Nano-second Pulse Width

자외선 나노초 펄스 레이저를 이용한 경연성(Rigid Flexible) 인쇄전자회로기판(Printed Circuit Board) 고속 절단에 관한 연구

  • 배한성 (주식회사 젯텍 기술연구소) ;
  • 박희천 (주식회사 젯텍 기술연구소) ;
  • 류광현 (주식회사 젯텍 기술연구소) ;
  • 남기중 (주식회사 젯텍 기술연구소)
  • Published : 2010.02.01

Abstract

High speed cutting processes of rigid flexible printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also robust laser cutting system has been designed and developed in order to obtain a good cutting quality of rigid and flexible PCB with multi-layers (2-6 layers). Power controller module developed for ourselves is adapted to control the laser output power in the range less than 1%. The systems show the good performance of cutting speed, cutting width and cutting accuracy, respectively. Especially we have confirmed that the short circuit problem due to the carbonized contamination occurred in cross section of multi-layers by thermal effect of high power laser has been improved largely by using multi-pass cutting process with low power and high speed.

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References

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