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75W급 LED 가로등 모듈의 방열판 최적화와 열특성 분석

Optimization of Heatsink and Analysis of Thermal Property in 75W LED Module for Street Lighting

  • 이승민 (원광대학교 공대 정보통신과) ;
  • 이세일 (원광대학교 공대 정보통신과) ;
  • 양종경 (원광대학교 공대 정보통신과) ;
  • 이종찬 (금호전기(주) 기술원 연구1팀) ;
  • 박대희 (원광대학교 전기전자 및 정보공학부)
  • 발행 : 2010.03.01

초록

In this paper, we optimized and simulated the heatsink of 75W LED module for street lighting and evaluated the optical properties with the manufactured heatsink. the structure of LED package make simple as chip and heatslug and thermal flow is analyzed by using the FEM(Finite Element Method) with CFdesign V10. Also, we measured the temperature of heatsink and evaluated the optical properties with infrared thermal image camera and integrated sphere system for luminous flux in $1\;[m^3]$ box. As results, Heatsink optimized in 3 mm pin thickness, 6 mm base thickness and 16 number of pin count by using Heatsink-designer and got the results which is the temperature of $47.37\;[^{\circ}C]$ and thermal resistance of $0.48407\;[W/^{\circ}C]$. In thermal flow simulation, the temperature of heatsink decreased from $51.54\;[^{\circ}C]$ to $51.51\;[^{\circ}C]$ and the temperature of heatsink by the time in real measurement decreased from $47.03\;[^{\circ}C]$ to $46.87\;[^{\circ}C]$. Moreover, we improve 0.68 % in the decreased ratio of the luminous flux.

키워드

참고문헌

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