DOI QR코드

DOI QR Code

Abatement of CF4 Using RF Plasma with Annular Shape Electrodes Operating at Low Pressure

환상형상 전극구조를 갖는 저압 RF plasma를 이용한 CF4 제거

  • Lee, Jae-Ok (Eco-machinery Research Division, Korea Institute of Machinery & Materials) ;
  • Hur, Min (Eco-machinery Research Division, Korea Institute of Machinery & Materials) ;
  • Kim, Kwan-Tae (Eco-machinery Research Division, Korea Institute of Machinery & Materials) ;
  • Lee, Dae-Hoon (Eco-machinery Research Division, Korea Institute of Machinery & Materials) ;
  • Song, Young-Hoon (Eco-machinery Research Division, Korea Institute of Machinery & Materials) ;
  • Lee, Sang-Yun (LOTVACUUM Co., Ltd., R&D) ;
  • Noh, Myung-Keun (LOTVACUUM Co., Ltd., R&D)
  • 이재옥 (한국기계연구원 그린환경에너지기계연구본부) ;
  • 허민 (한국기계연구원 그린환경에너지기계연구본부) ;
  • 김관태 (한국기계연구원 그린환경에너지기계연구본부) ;
  • 이대훈 (한국기계연구원 그린환경에너지기계연구본부) ;
  • 송영훈 (한국기계연구원 그린환경에너지기계연구본부) ;
  • 이상윤 ((주)엘오티베큠 기술연구소) ;
  • 노명근 ((주)엘오티베큠 기술연구소)
  • Received : 2010.09.28
  • Accepted : 2010.11.04
  • Published : 2010.12.31

Abstract

Abatement of perfluorocompounds (PFCs) used in semiconductor and display industries has received an attention due to the increasingly stricter regulation on their emission. In order to meet this circumstance, we have developed a radio frequency (RF) driven plasma reactor with multiple annular shaped electrodes, characterized by an easy installment between a processing chamber and a vacuum pump. Abatement experiment has been performed with respect to $CF_4$, a representative PFCs widely used in the plasma etching process, by varying the power, $CF_4$ and $O_2$ flow rates, $CF_4$ concentration, and pressure. The influence of these variables on the $CF_4$ abatement was analyzed and discussed in terms of the destruction & removal efficiency (DRE), measured with a Fourier transform infrared (FTIR) spectrometer. The results revealed that DRE was enhanced with the increase in the discharge power and pressure, but dropped with the $CF_4$ flow rate and concentration. The addition of small quantity of $O_2$ lead to the improvement of DRE, which, however, leveled off and then decreased with $O_2$ flow rate.

Keywords

References

  1. Chang, M.B. and J.S. Chang (2006) Abatement of PFCs fromsemiconductor manufacturing processes by nonthermalplasma technologies; a critical review, Ind.Eng. Chem. Res., 45, 4101-4109. https://doi.org/10.1021/ie051227b
  2. Huang, H. and L. Tang (2009) Pyrolysis treatment of wastetire powder in a capacitive coupled RF plasma reactor,Energy Conversion and Management, 50, 611-617. https://doi.org/10.1016/j.enconman.2008.10.023
  3. Kiehlbauch, M.W. and D.B. Graves (2001) Temperature resolvedmodeling of plasma abatement of perfluorinatedcompounds, J. of Applied Physics, 89(4),2047-2057. https://doi.org/10.1063/1.1337088
  4. Kim, K.-T., D.H. Lee, J.O. Lee, M.S. Cha, and Y.-H. Song(2010) $CF_4$ treatment characteristics using an elongatedarc reactor, J. Korean Soc. Atmos. Environ.,26(1), 85-93. (in Korean with English abstract) https://doi.org/10.5572/KOSAE.2010.26.1.085
  5. Kim, K.-T., Y.-H. Kim, M.S. Cha, Y.-H. Song, S.-J. Kim, andJ.-I. Ryu (2004) Decomposition characteristics ofPFCs for various plasma discharge methods indielectric barrier discharge, J. Korean Soc. Atmos.Environ., 20(5), 625-632. (in Korean with Englishabstract)
  6. Kuroki, T., J. Mine, M. Okubo, T. Yamamoto, and N. Saeki(2005) $CF_4$ decomposition using inductively coupledplasma: effect of power frequency, IEEE Transactionon Industry Applications, 41(1), 215-220. https://doi.org/10.1109/TIA.2004.840948
  7. Kuroki, T., J. Mine, S. Odahara, M. Okubo, T. Yamamoto,and N. Saeki (2005) $CF_4$ decomposition of flue gasfrom semiconductor prosess using inductively coupledplasma, IEEE Transaction on Industry Applications,41(1), 221-228. https://doi.org/10.1109/TIA.2004.840954
  8. Lang, N., J. Roepcke, H. Zimmermann, A. Steinbach, and S.Wege (2009) In situ monitoring of plasma etch processeswith a quantum cascade laser arrangementin semiconductor industrial environment, J. of Physics:Conference Series, 157, 012007. https://doi.org/10.1088/1742-6596/157/1/012007
  9. Nagai, M., M. Hori, and T. Goto (2005) Decomposition andpolymerization of perfluororinated compounds inmicrowave-excited atmospheric pressure plasma, J.of Applied Physics, 97, 123304. https://doi.org/10.1063/1.1931034
  10. Tonnis, E.J., V. Vartanian, L. Beu, T. Lii, R. Jewett, and D.Graves (1998) Evaluation of a Litmas “Blue” pointofuse (POU) plasma abatement device for perfluorocompounds(PFC) destruction, International SEMATECHTechnol. Transfer 98123605A-ENG.
  11. Vartanian, V., L. Beu, T. Lii, B. Wofford, C. Hartz, and J. Bevan(1998) Evaluation of Rf environmental systems/Texas A&M university surface wave plasma devicefor abatement of perfluorocompounds (PFC) emissions,International SEMATECH, Technol. Transfer 98093561A-ENG.