Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Investigation of Ag Migration from Ag Paste Bump in Printed Circuit Board

Ag Paste bump 구조를 갖는 인쇄회로기판의 Ag migration 발생 안전성 평가

  • Song, Chul-Ho (Department of Nano Fusion Technology, Pusan National University) ;
  • Kim, Young-Hun (Department of Nano Fusion Technology, Pusan National University) ;
  • Lee, Sang-Min (Department of Nano Fusion Technology, Pusan National University) ;
  • Mok, Jee-Soo (Samsung Electro-Mechanics, ACI Division, Advanced Technology Team) ;
  • Yang, Yong-Suk (Department of Nano Fusion Technology, Pusan National University)
  • 송철호 (부산대학교 나노과학기술대학, 나노융합기술학과) ;
  • 김영훈 (부산대학교 나노과학기술대학, 나노융합기술학과) ;
  • 이상민 (부산대학교 나노과학기술대학, 나노융합기술학과) ;
  • 목지수 (삼성전기 기판사업부 기판선행개발팀) ;
  • 양용석 (부산대학교 나노과학기술대학, 나노융합기술학과)
  • Published : 2010.01.27
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Abstract

The current study examined Ag migration from the Ag paste bump in the SABiT technology-applied PCB. A series of experiments were performed to measure the existence/non-existence of Ag in the insulating prepreg region. The average grain size of Ag paste was 30 nm according to X-ray diffraction (XRD) measurement. Conventional XRD showed limitations in finding a small amount of Ag in the prepreg region. The surface morphology and cross section view in the Cu line-Ag paste bump-Cu line structure were observed using a field emission scanning electron microscope (FE-SEM). The amount of Ag as a function of distance from the edge of Ag paste bump was obtained by FE-SEM with energy dispersive spectroscopy (EDS). We used an electron probe micro analyzer (EPMA) to improve the detecting resolution of Ag content and achieved the Ag distribution function as a function of the distance from the edge of the Ag paste bump. The same method with EPMA was applied for Cu filled via instead of Ag paste bump. We compared the distribution function of Ag and Cu, obtained from EPMA, and concluded that there was no considerable Ag migration effect for the SABiT technology-applied printed circuit board (PCB).

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References

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