한국전기전자재료학회논문지 (Journal of the Korean Institute of Electrical and Electronic Material Engineers)

  • 제23권12호
  • /
  • Pages.973-977
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  • 2010
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  • 1226-7945(pISSN)
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  • 2288-3258(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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단일 패키지의 특성 분석을 통한 고출력 발광 다이오드 모듈의 접합 온도 측정

Measurement of Junction Temperature in High Power LED Module with Property Analysis of Single Package

  • Lee, Se-IL (Department of Electrical & Information Engineering, Wonkwang University) ;
  • Kim, Woo-Young (Department of Electrical & Information Engineering, Wonkwang University) ;
  • Jeong, Young-Gi (Department of Electrical & Information Engineering, Wonkwang University) ;
  • Yang, Jong-Kyung (Department of Electrical & Information Engineering, Wonkwang University) ;
  • Park, Dae-Hee (Department of Electrical & Information Engineering, Wonkwang University)
  • 투고 : 2010.09.27
  • 심사 : 2010.11.03
  • 발행 : 2010.12.01
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초록

The temperature of junction in LED affects the life time and performance. however, the measurement of junction temperature in module is very difficult. In this paper, to measure the junction temperature in LED module, optical and electrical properties is measured in single package in temperature from 25 [$^{\circ}C$] to 85 [$^{\circ}C$], and then junction temperature can is estimated in module with measuring the average voltage of single package. As results, the junction temperature of single package is measured the temperature of 61.2 [$^{\circ}C$] in ambient temperature, also, the junction temperature of LED module is measured the temperature of 72.5 [$^{\circ}C$] in ambient temperature.

키워드

참고문헌

  1. H. Lee, J. Park, M. Kim, H. Kim, and J. Kim, J. KIEEME, 22, 1033, (2009).
  2. S. Lee, S. Lee, J. Yang, J. Lee, and D. Park, Trans. KIEE, 59, 609, (2010).
  3. J. Hu, L. Yang, and M. Shin, J. Phys. d:Appl. Phys. 41, (2008).
  4. M. Shin and J. Kim, Introduction to LED Packaging Technology , Bookshill, 283, (2009).
  5. E. F. Schubert, Light Emitting Diodes, 2nd cd. (Cambridge University Press, Cambridge, 2006), p. 97.
  6. J. Hu, L. Yang, W. Hwang, and M. Shin, J. Cry. Gro, 288, 157, (2006). https://doi.org/10.1016/j.jcrysgro.2005.12.049
  7. J. Hu, L. Yang, and M. Shin, Mic. J, 38, 157, (2007).
  8. J. Park, H. Kim, J. Kim, W. Chun, and S. Song, KIIEE. Spring Conference, (Y. P. resort, 2009), p. 252.
  9. X. Luo, W. Xiong, and S. Liu, ICEPT-HDP 1, (2008).
  10. L. Wang, P. Gu, and S. Jin, OPTICS LETTERS, 34, 301, (2009). https://doi.org/10.1364/OL.34.000301
  11. EIA/JESD51-1, (1995).

피인용 문헌

  1. Thermal Dissipation Characteristics of Multi-Chip LED Packages vol.25, pp.12, 2011, https://doi.org/10.5207/JIEIE.2011.25.12.034
  2. Comparison of the Thermal Performance of the Multichip LED Packages vol.2, pp.11, 2012, https://doi.org/10.1109/TCPMT.2012.2200483