Development of Panel Alignment Algorithm and Its Application to BGA Lithography Equipment

기판 정렬 알고리즘 개발 및 BGA 노광 장비 적용

  • Ryu, SUN-Joong (Advanced Technology Team, Samsung Electro Mechanics Co. LTD.)
  • 유선중 (삼성전기 기판선행개발팀)
  • Published : 2009.11.01

Abstract

Alignment error of the BGA lithography equipment is mainly caused by the dimensional change of the BGA panel which is generated during the manufacturing processes. To minimize the alignment error, 'mark alignment' algorithm in place of 'center alignment' algorithm was proposed and the optimal solution for the algorithm was derived by simple analytic form. The developed algorithm distributes evenly the alignment error over the whole panel which was evaluated by the numerical simulation. Finally, the developed algorithm was implemented to the controller of the lithography equipment and the alignment error was measured at the fiducial mark location. From the measurement, it is also concluded that the developed alignment algorithm be effective to reduce the maximum value of alignment error.

Keywords

References

  1. Tick, T. and Jantunen, H., "An X-Ray Imaging-Based Layer Alignment and Tape Deformation Inspection System for Multilayer Ceramic Circuit Boards," IEEE Trans. Electronics Packing Manufacturing, Vol. 31, No. 2, pp. 168-173, 2008 https://doi.org/10.1109/TEPM.2008.919330
  2. Park, I., Park, Y., Lee, M., Shin, D., Lee, K., Jang, S., Yim, H. and Jeon, J., "Error Source Analysis for Alignment Process by using Fiducial Marks in Large-Area Nano-Imprint Lithography," Proceedings of the Korean Society of Mechanical Engineering, pp. 83-89, 2006
  3. Shin, D., "Measurement and Correction of PCB Alignment Error for Screen Printer Using Machine Vision (1)," Journal of the Korean Society for Precision Engineering, Vol. 20, No. 6, pp. 88-95, 2003
  4. Shin, D., "Measurement and Correction of PCB Alignment Error for Screen Printer Using Machine Vision (2)," Journal of the Korean Society for Precision Engineering, Vol. 20, No. 6, pp. 96-104, 2003
  5. Kwon, S. and Park, C., "Kinematics and Control of the 4-Axes Visual Alignment System," SCIE-ICASE International Joint Conference, pp. 1389-1393, 2006
  6. Kim, H. T., Song, C. S. and Yang, H. J., "A study on the Automatic Wafer Alignment in Semiconductor dicing," Journal of the Korean Society for Precision Engineering, Vol. 20, No. 12, pp. 105-114, 2003
  7. Han, S.-J., Park, J.-H. and Park, H.-J., "Development of Three D.O.F Alignment Stage for Vacuum Environment," Journal of the Korean Society for Precision Engineering, Vol. 18, No. 11, pp. 138-147, 2001
  8. Uhm, C., Kim, B. H. and Choi, Y. S., "Development of Automatic Optical Fiber Alignment System and Optical Alignment Algorithm," Journal of the Korean Society for Precision Engineering, Vol. 21, No. 4, pp. 194-201, 2004