마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제16권3호
  • /
  • Pages.25-29
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  • 2009
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
권호 표지

NCP 적용 COB 플립칩 패키지의 신뢰성 연구

Study on the Reliability of COB Flip Chip Package using NCP

  • 이소정 (한국생산기술연구원 용접접합연구부) ;
  • 유세훈 (한국생산기술연구원 용접접합연구부) ;
  • 이창우 (한국생산기술연구원 용접접합연구부) ;
  • 이지환 (인하대학교 금속공학과) ;
  • 김준기 (한국생산기술연구원 용접접합연구부)
  • Lee, So-Jeong (Advanced Welding & Joining R&D Department, KITECH) ;
  • Yoo, Se-Hoon (Advanced Welding & Joining R&D Department, KITECH) ;
  • Lee, Chang-Woo (Advanced Welding & Joining R&D Department, KITECH) ;
  • Lee, Ji-Hwan (School of Materials Science & Engineering, Inha University) ;
  • Kim, Jun-Ki (Advanced Welding & Joining R&D Department, KITECH)
  • 발행 : 2009.09.30
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초록

COB(chip-on-board) 플립칩 패키지에 있어서 NCP(non-conductive paste)의 적용성을 확보하기 위해 자체 포뮬레이션한 NCP와 상용 NCP에 대하여 보드레벨 플립칩 패키지를 제작하고 고온고습 및 열충격 신뢰성을 평가하였다. 실험결과 보다 작은 입도의 용융 실리카를 첨가한 NCP 시제품들이 고온고습 신뢰성에 유리한 것을 알 수 있었다. 또한, NCP 접속부에 있어서 열응력에 의한 피로보다 흡습에 의한 에폭시의 팽창이 접속부 파손에 보다큰 영향을 미치는 것으로 나타났으며, NCP의 접착강도가 높을수록 NCP 플립칩 패키지의 열충격 신뢰성이 향상되는 것을 알 수 있었다.

High temperature high humidity and thermal shock reliability tests were performed for the board level COB(chip-on-board) flip chip packages using self-formulated and commercial NCPs(non-conductive pastes) to ensure the performance of NCP flip chip packages. It was considered that the more smaller fused silica filler in prototype NCPs is more favorable for high temperature high humidity reliability. The failure of NCP interconnection was affected by the expansion of epoxy due to moisture absorption rather than the fatigue due to thermal stress. It was considered that the NCP having more higher adhesive strength seems to be more favorable to increase the thermal shock reliability.

키워드

참고문헌

  1. Horatio Quinones and Alec Babiarz, "Reliability statistics for flip chip and CSP interconnection", IMAPS Nordic, Helsinki, Finland, pp.1-8 (1999)
  2. Paul S. Ho, Guotao Wang, Min Ding, Jie-Hua Zhao and Xiang Dai, "Reliability issues for flip-chip packages", Microelectronics Reliability, Vol. 44, Issue 5, pp.719-737 (2004)
  3. K. W. Paik and M. J. Yim, "Anisotropic conductive flim for flip chip package", Journal of the KSME, Vol. 45, No. 6, pp.57-63 (2005)
  4. Bo-In Noh, Jong-Bum Lee, Sung-Ho Won and Seung-Boo Jung, "Characteristics of reliability for flip chip package with non-conductive paste", Journal of the microeletronics & packaging society, Vol. 14, No. 4, pp.9-14 (2007)
  5. John Liu, "ACA bonding technology for low cost electronics packaging applications - current status and remaining challenges", Journal of Soldering & Surface Mount Technology, Vol. 13, No. 3, pp.39-57 (2001) https://doi.org/10.1108/09540910110407397
  6. S.C. TAN, Y.C. CHAN and NELSON S.M. LUI, "Process optimization to overcome void formation in nonconductive paste interconnections for fine-pitch applications", Journal of Electronic Materials, Vol. 34, No. 8, pp.1143-1149 (2005) https://doi.org/10.1007/s11664-005-0243-x
  7. Chin-Lung Chiang, Chen-Chi M. Ma, Feng-Yih Wang and Hsu-Chiang Kuan , "Thermo-oxidative degradation of novel epoxy containing silicon and phosphorous nanocomposites", European Polymer Journal, Vol. 39, Issue 4, pp.825-830 (2003) https://doi.org/10.1016/S0014-3057(02)00283-5
  8. Maksim Antonov and Irina Hussainova, "Thermophysical properties and thermal shock resistance of chromium carbide based cermets", Proc. Estonian Acad. Sci. Eng., Vol. 12, No. 4, pp.358-367 (2006)