참고문헌
- K. Yasuda, J. M. Kim and K. Fujimoto : Adhesive Joining Process and Joint Property With Low Melting Point Filler, Journal of Electronic Packaging, 127 (2005), 12-17 https://doi.org/10.1115/1.1846060
- F. Tan, X. Qiao, J. Chen and Hongshui Wang : Effects of Coupling Agents on the Properties of Epoxy-Based Electrically Conductive Adhesives, International Journal of Adhesion & Adhesives 26 (2006), 406-413 https://doi.org/10.1016/j.ijadhadh.2005.06.005
- H. K. Kim, F. G. Shi : Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density, Microelectronics Journal 32 (2001), 315-321 https://doi.org/10.1016/S0026-2692(01)00007-6
- D. Wojciechowski, J. Vanfleteren, E. Reese and H.-W. Hagedorn : Electro-Conductive Adhesives for High Density Package and Fip-chip Interconnections, Microelectronics Reliability 40 (2000), 1215-1226 https://doi.org/10.1016/S0026-2714(00)00049-4
- Y. Li, C.P. Wong : Recent Advances of Conductive Adhesives as a Lead-Free Alternative in Electronic Packaging: Materials, Processing, Reliability and Applications, Materials Science and Engineering, 51-1-3 (2006), 1-35 https://doi.org/10.1016/j.mser.2006.01.001
- Q. K. Tong, D. L. Markley, G. Frederickson, R. Kuder and D. Lu : Conductive Adhesives with Stable Contact Resistance and Superior Impact Performance, Electronic Components and Technology Conference, 1-4 (1999), 347-352
- Y. S. Eom, J. W. Baek, J. T. Moon, J. D. Nam and J. M. Kim : Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film, Microelectronic Engineering, 85 (2008), 327-331 https://doi.org/10.1016/j.mee.2007.07.005
- M. Zwolinski, J. Hickman, H. Rubin, Y. Zaks, S. McCarthy, T. Hanlon, P. Arrowsmith, A. Chaudhuri, R. Harmansen, S. Lau and D. Napp : Electrically Conductive Adhesives for Surface Mount Solder Replacement, IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part C, 19-4 (1996), 241-250 https://doi.org/10.1109/3476.558550
- K. S. Moon, J. Wu and C. P. Wong : Improved Stability of Contact Resistance of Low Melting Point Alloy Incorporated Isotropically Conductive Adhesives, IEEE Transactions on Components and Packaging Technologies, 26-2 (2003), 375-381 https://doi.org/10.1109/TCAPT.2003.815101
- S. K. Kang and S. Purushothaman : Development of Conducting Adhesive Materials for Microelectronic Applications, Journal of Electronic Materials. 28-11 (1999), 1314-1318 https://doi.org/10.1007/s11664-999-0173-0
- J. M. Kim, K. Yasuda, M. Rito and K. Fujimoto : New Electrically Conductive Adhesives Filled with Low Melting Point Alloy Fillers, Mater. Trans. 45 (2004), 157-160 https://doi.org/10.2320/matertrans.45.157
- J. M. Kim, K. Yasuda, M. Yasuda and K. Fujimoto : The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly, Mater. Trans. 45 (2004), 793-798 https://doi.org/10.2320/matertrans.45.793
- J. M. Kim, K. Yasuda and K. Fujimoto : Novel Interconnection Method Using Electrically Conductive Paste with Fusible Filler, Journal of Electronic Materials, 34-5 (2005), 600-604 https://doi.org/10.1007/s11664-005-0071-z