Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Through Silicon Via Filling and Fine Pitch Joining Technology for 3D Electronic Package

3D 전자패키징용 관통실리콘비아의 충진 및 미세피치 접합기술

  • 유세훈 (한국생산기술연구원 용접접합기술지원센터) ;
  • 이창우 (한국생산기술연구원 용접접합기술지원센터)
  • Published : 2009.06.30
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References

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