Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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The Supplement of Sn/Cu, Plating Solution Affects in Plating Skim Quality of the Plating Product

Sn/Cu 도금액의 보충이 도금제품의 도금피막특성에 미치는 영향

  • Jeon, Taeg-Jong (Department of Mechanical Engineering, chungnam Univ.) ;
  • Ko, Jun-Bin (Department of Machine Design Engineering, Hanbat Univ.) ;
  • Lee, Dong-Ju (Department of Mechanical Engineering, chungnam Univ.)
  • 전택종 (충남대학교 대학원 기계공학과) ;
  • 고준빈 (한밭대학교 기계설계공학과) ;
  • 이동주 (충남대학교 대학원 기계공학과)
  • Published : 2009.07.01
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Abstract

The purpose of this study is to evaluate the evaluation of process yield performed by using Sn & Cu treatment on the surface to optimize process condition for Lead-free solder application. The materials which are used for the New Surface Treatment study are Semi-Dulling plating for high speed Sn/Cu alloy of Soft Alloy GTC-33 Pb free known as "UEMURA Method" and plating substrate is alloy 42.Especially in lead-free plating process, it is important to control plating thickness and Copper composition than Sn/Pb plating. Evaluated and controlled plating thickness $12{\pm}3um$, Copper composition $2{\pm}1%$, plating particle and visual inspection. The optimization of these parameters and condition makes it makes possible to apply Sn/Cu Lead-free solder from Sn/Pb alloy.

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References

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