References
- H.T.Kim, S.C.Kil, and W.S.Hwang, Corrosion Science and Technology, 6, 74 (2007)
- H.Y.Chang, J.S.Kim, and T.E.Jin, Corrosion Science and Technology, 6, 29 (2007)
- S.Xue, X.Huang, Y.Wu, and Z.Han, Transactions of the China Welding Institution, 28, 21 (2007)
- V.L.Lanin, Elektronnaya Obrabotka Materialov, 3, 79 (2005)
- L.Bosse, A.Schildecker, A.Gillner, and R.Poprawe, Microsystem Technologies, 7, 215 (2002) https://doi.org/10.1007/s005420100111
- F.Herbert, L.Dorn, and S.Shrestha, Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, p. 140 (2001)
- J.S.Hwang, SMT Surface Mount Technology Magazine, 13, 2 (1999)
- J.Suh, KIMM(Korea Research Institute of Machinery & Materials) Report, 2005
- M.H.Ware, H.Mark, and C.A.Buckley, Biomedical Sciences Instrumentation, 39, 1 (2003)
- D.Simhon, A.Ravid, M.Halpern, T.Brosh, T.Vasilyev, D.Levanon, N.Kariv, and A.Katzir, Proceedings of SPIE, The International Society for Optical Engineering, 4609, 215 (2002) https://doi.org/10.1117/12.433862
- E.C.Soller, G.T.Hoffman, and K.M.McNally-Heintzelman, Biomedical Sciences Instrumentation, 38, 339 (2002)
- D.Shumalinsky, L.Lobik, S.Cytron, M.Halpern, T.Vasilyev, A.Ravid, A.Levita, and A.Katzir, Proceedings of SPIE, The International Society for Optical Engineering, 4940, 227 (2002)