참고문헌
- 1981, Hanamann, R.J., "Microelectronic Device Thermal Resistance: A Format for standardization," Heat Transfer in Electronic Equipment(ASME JITD-20), pp.39-48
- 2000, 김용진, 홍성현, "[특집] Heat sink용 분말재료기술," 기계와 재료, 제12권, 제3호
- 1978, Sparrow, E.M. and Ramsey, J.W., "Heat transfer and pressure drop for a staggered wall-attached array of cylinders with tip clearance," Int. J. Heat Mass Transfer, Vol.21, pp.1369-1377 https://doi.org/10.1016/0017-9310(78)90200-4
- 1980, Sparrow, E.M., Ramsey, J.W. and Altemani, C.A.C., "Experiments on in-line pin fin arrays and performance comparison with staggered arrays," ASME J. Heat Transfer, Vol.102, pp.44-50 https://doi.org/10.1115/1.3244247
- 1982, Metzger, D.E., Berry, R.A. and Bronson, J.P., "Developing heat transfer in rectangular ducts with staggered arrays of short pin fins," ASME J. Heat Transfer, Vol.104, pp.700-706 https://doi.org/10.1115/1.3245188
- 1984, Simoneau, R.J. and Van Fossen, G.J., "Effect of location in an array on heat transfer to a short cylinder in crossflow," ASME J. Heat Transfer, Vol.106, pp.42-48 https://doi.org/10.1115/1.3246657
- 1990, Chyu, M.K., "Heal transfer and pressure drop for short pin fin arrays with pin-endwall fillet," ASME J. Heat Transfer, Vol.112, pp.926-932 https://doi.org/10.1115/1.2910502
- 2001, Tanda, G., "Heat transfer and pressure drop in a rectangular channel with diamond-shaped elements," Int. J. Heat and Mass Transfer, Vol.44, pp.3529-3541 https://doi.org/10.1016/S0017-9310(01)00018-7
- 1996, Tagliafico, L. and Tanda, G., "A thermodynamic method for the comparison of plate-fin heat exchanger performance," ASME J. Heat Transfer, Vol.118, pp.805-809 https://doi.org/10.1115/1.2822706
- 2001, Menler, F. and Esch, T., "Elements of Industrial Heat Transfer predictions," 16th Brazilian Congress of Mechanical Engineering, Uberlandia, Brazil
- 1983, Kraus, A.D. and Bar-Cohen, A., Thermal Analysis and Control of Electronic Equipment, McGraw Hill, New York
- 2000, Kim, S.J., Kim, D. and Lee, D.Y., "On the Local Thermal Equilibrium in Microchatmel Heat Sinks," Int. J. of Heat and Mass Transfer, Vol.43, pp.1735-1748 https://doi.org/10.1016/S0017-9310(99)00259-8
- 1997, Bardina, J.E., Huang, P.G. and Coakly, T., "Turbulent modelling validation," AlAA, pp.1997-2121
- 1995, Chyu, M.K. and Natarajan, V., "Heat transfer on the base surface of three-dimensional protruding elements," Int. J. Heat Mass Transfer, Vol.39, No.14, pp.2925-2935 https://doi.org/10.1016/0017-9310(95)00381-9
- 1996, Oktay, S., Hannemann, R. and Bar-Cohen, A., "High Heat from a Small Package," Mechanical Engineering, Vol.108, pp.36-42