조명전기설비학회논문지 (Journal of the Korean Institute of Illuminating and Electrical Installation Engineers)

  • 제23권5호
  • /
  • Pages.29-35
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  • 2009
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  • 1229-4691(pISSN)
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  • 2287-5034(eISSN)
한국조명전기설비학회 (The Korean Institute of IIIuminating and Electrical Installation Engineers)
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디지털 FID용 패널제작과 패키 방법에 관한 연구

A Study on Panel Manufacture and Packaging Method for Digital FED

  • 김수용 (군산대학교 전자정보공학부)
  • 발행 : 2009.05.31
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⟨ 이전 논문 다음 논문 ⟩

초록

FED는 잠재적인 평판기술에 따라 현재 연구되고 있다. 이 논문의 제안은 FED 핵심적인 개발을 위한 진공 패키징 기술에 대한 연구결과를 보여준다. FED 진공 패키징을 위해서는 유리/유리 접합, 진공배기, 게터기술, 그리고 시뮬레이션, 진공패키징 기술을 연구하였다. 유리/유리 접합은 프릿 글래스를 사용하므로 형태에 따르고, 내부 압력은 $2{\times}10^{-5}$[Torr]이며 패널로서 완성을 보여준다. 게터의 결과에 따라 그것은 압력의 증가는 박막 게터에 의해 불순기체가 줄어드는 것을 보여주었다.

Field emission displays(FED) are currently being study as a potential flat technology. The purpose of this project shows the research result of vacuum packaging technology for the development of FED. For FED vacuum packaging, the bonding of glass/glass, the exhaust of vacuum and getter technology have been studied for vacuum packaging technology The simulation and vacuum sealing, and glass/glass bonding are also extensively studied. The glass/glass bonding is formed by using the frit glass and the Inside pressure of complete panel showed of $2{\times}10^{-5}$[Torr]. As a getter result, the increase of pressure has been showed the decrease of outgassing effect by using thin film getter.

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참고문헌

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