Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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Removal of Nano-scaled Fluorescence Particles on Wafer by the Femtosecond Laser Shockwave

펨토초레이저 충격파에 의한 형광 나노입자 제거

  • Park, Jung-Kyu (Nano-mechanical Systems, Korea Institute of Machinery & Materials) ;
  • Cho, Sung-Hak (Nano-mechanical Systems, Korea Institute of Machinery & Materials) ;
  • Kim, Jae-Gu (Nano-mechanical Systems, Korea Institute of Machinery & Materials) ;
  • Chang, Won-Seok (Nano-mechanical Systems, Korea Institute of Machinery & Materials) ;
  • Whang, Kyung-Hyun (Nano-mechanical Systems, Korea Institute of Machinery & Materials) ;
  • Yoo, Byung-Heon (Korea Science and Engineering Foundation) ;
  • Kim, Kwang-Ryul (Department of electronics and computer engineering, Hanyang University)
  • 박정규 (한국기계연구원 나노융합기계) ;
  • 조성학 (한국기계연구원 나노융합기계) ;
  • 김재구 (한국기계연구원 나노융합기계) ;
  • 장원석 (한국기계연구원 나노융합기계) ;
  • 황경현 (한국기계연구원 나노융합기계) ;
  • 유병헌 (한국과학재단) ;
  • 김광열 (한양대학교 전자통신컴퓨터공학부)
  • Published : 2009.05.01
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Abstract

The removal of tiny particles adhered to surfaces is one of the crucial prerequisite for a further increase in IC fabrication, large area displays and for the process in nanotechnology. Various cleaning techniques (wet chemical cleaning, scrubbing, pressurized jets and ultrasonic processes) currently used to clean critical surfaces are limited to removal of micrometer-sized particles. Therefore the removal of sub-micron sized particles from silicon wafers is of great interest. For this purpose various cleaning methods are currently under investigation. In this paper, we report on experiments on the cleaning effect of 100nm sized fluorescence particles on silicon wafer using the plasma shockwave occurred by femtosecond laser. The plasma shockwave is main effect of femtosecond laser cleaning to remove particles. The removal efficiency was dependent on the gap distance between laser focus and surface but in some case surface was damaged by excessive laser intensity. These experiments demonstrate the feasibility of femtosecond laser cleaning using 100nm size fluorescence particles on wafer.

Keywords

References

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