Korean Chemical Engineering Research

  • 제47권3호
  • /
  • Pages.332-336
  • /
  • 2009
  • /
  • 0304-128X(pISSN)
  • /
  • 2233-9558(eISSN)
한국화학공학회 (The Korean Institute of Chemical Engineers)
권호 표지

나노 실리카 및 실록산이 초소형 전자소재 접착제용 에폭시 복합재의 물성에 미치는 효과

Effects of Nano Silica and Siloxane on Properties of Epoxy Composites for Adhesion of Micro Electronic Device

  • 이동현 (광운대학교 화학공학과) ;
  • 김대흠 (광운대학교 화학공학과)
  • Lee, Donghyun (Department of Chemical Engineering., Kwangwoon University) ;
  • Kim, Daeheum (Department of Chemical Engineering., Kwangwoon University)
  • 투고 : 2009.01.20
  • 심사 : 2009.05.11
  • 발행 : 2009.06.30
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

초소형 전자소재 접착용 고분자 소재 접착제는 접착소재와 칩 또는 기판 간의 열팽창계수 차이에 의한 박리, 크래킹과 접착력 부족 등의 문제점이 발생된다. 이러한 결점의 보완을 위하여 무기입자 및 첨가물을 통해 접착제의 열팽창계수를 낮추거나, 접착제의 유연성을 부여하는 방법 등이 사용되고 있다. 실록산/실리카/에폭시 나노복합재에서 실록산과 실리카의 첨가가 열적, 기계적 물성에 미치는 효과를 확인하기 위한 실험을 진행하였다. 3-glycidoxypropyltrimethoxysilane(GPTMS)로 처리하여 친수성의 나노실리카 입자를 소수성 입자로 변성시켜 고분자 매트릭스와의 상용성 문제를 해결하고자 하였다. 표면처리하지 않은 실리카인 $Aerosil^{(R)}$200을 첨가한 AMS/Aerosil/에폭시 나노복합재의 유리전이온도는 125에서 $118^{\circ}C$로 감소하였고, 모듈러스는 2,225에서 2,523 MPa까지 증가하였다. 표면처리한 M-silica를 첨가한 AMS/M-silica/에폭시 나노복합재 또한 비슷한 경향이었으며, 유리전이온도가 124에서 $120^{\circ}C$로 감소했고 모듈러스는 1,981에서 2,743 MPa까지 증가하였다. 실리카의 표면개질 유무에 상관없이 열팽창계수는 감소하는 추세를 보였다.

When NCAs(non-conductive adhesives) are used for adhesion of micro-electronic devices, they often show problems such as delamination and cracking, due to the differences of CTE(coefficients of thermal expansion) between NCAs and substrates. Additions of inorganic particles or flexibilizers have been performed to solve those problems. The effects of silica addition on thermal/mechanical properties of amino modified siloxane(AMS)/silica/epoxy-nanocomposites were examined. The silica was treated by 3-glycidoxypropyltrimethoxysilane(GPTMS) for better compatibility between silica and epoxy matrix. AMS/silica/epoxy-nanocomposites filled with various amounts of AMS(1 and 3 phr) and various amounts of silica(3, 5 and 7 phr) were prepared. And Tg, moduli and CTE of nanocomposites were analyzed. Tg of AMS/Aerosil(non-modified silica)/epoxy-nanocomposites decreased from 125 to $118^{\circ}C$ with increasing Aerosil contents and moduli increased from 2,225 to 2,523 MPa with increasing Aerosil contents. Tg of AMS/M-silica (modified silica)/epoxy-nanocomposites decreased from 124 to $120^{\circ}C$ with increasing M-silica contents and moduli increased from 1,981 to 2,743 MPa with increasing M-silica contents. CTE of AMS/Aerosil/epoxy-nanocomposites and AMS/M-silica/epoxy-nanocomposites showed decreasing tendency regardless of the surface treatments.

키워드

참고문헌

  1. Lee, J. W. and Yoo, J. Y., "Die Attach Adhesive Films for Semiconductor Chip Stacking Process," 2006 TCI Report, 1-60(2006)
  2. Kim, J. M., "Recent Advances on Conductive Adhesives in Electronic Packaging," Journal of KWJS, 25, 133-138(2007) https://doi.org/10.5781/KWJS.2007.25.2.031
  3. Matejka, L., Dukh, O. and Kolarik, J., 'Polymer, Reinforcement of Crosslinked Rubbery Epoxies by in-situ Formed Silica,' 41, 1449 (2000) https://doi.org/10.1016/S0032-3861(99)00317-1
  4. Haas, K.-H. and Wolter, H., "Synthesis, Properties and Applications of Inorganic-organic Copolymers," Curr. Opin. Solid St. M., 4, 571(1999) https://doi.org/10.1016/S1359-0286(00)00009-7
  5. Salahuddin, N., Moet, A., Hiltner, A. and Baer, E., "Nanoscale Highly Filled Epoxy Nanocomposite," Eur. Polym. J., 38, 1477(2002) https://doi.org/10.1016/S0014-3057(02)00015-0
  6. Matejka, L., Dusek, K., Kriz, J. and Lednicky, F., "Formation and Structure of the Epoxy-Silica Hybrids," Polymer, 40, 171(1998) https://doi.org/10.1016/S0032-3861(98)00214-6
  7. Min, B. K., 'The Concept of Composite Material and It''s Application,' Polymer(Korea), 12, 599(1988)
  8. Li, Y. and Wong, C. P., "Recent Advances of Conductive Adhesives as a Lead-Free Alternative in Electronic Packaging: Materials, Processing, Reliability and Applications," Materials Science and Engineering R: Reports, 51, 1-35(2006) https://doi.org/10.1016/j.mser.2006.01.001
  9. Yim, M. J. and Paik, K. W., 'High Frequency Properties of Anisotropic Conductive Films(ACFs) for Flip Chip Package Application,' Electronic Materials Letters, 2, 7-14(2006)
  10. Yim, M. J. and Paik, K. W., 'Recent Advances in Anisotropic Conductive Adhesives for Microelectronics Packaging Applications', Ceramist, 8, 23-39(2005)
  11. Jang, K. W., Kwon, W. S., Yim, M. J. and Paik, K. W., 'Effects of Silica Filler and Diluent on Material Properties of Non-Conductive Pastes and Thermal Cycling Reliability of Flip Chip Assembly,' J. of the Microelectronics & Packaging Society, 10, 9-17 (2003)
  12. Paik, K. W. and Yim, M. J., 'Reliability Enhancement of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates by Non-Conducting Filler Additions,' J. of the Microelectronics & Packaging Society, 7, 41-49(2000)
  13. Yim, M. J. and Paik, K. W., 'Effect of Non-conducting Filler Additions on Anisotropic Conductive Adhesive(ACAs) Properties and Reliability of ACAs Flip-chip on Organic Substrates,' Korean Journal of Materials Research, 10, 184-190(2000)
  14. Kim, L. J., Yoon, H. G., Lee, S. S. and Kim, J. K., 'Novel Preparation of Epoxy/Silica Nanocomposite Using Si-N Precursor,' Polymer(Korea), 28, 391-396(2004)
  15. Liu, Y. L., Hsu, C. Y., Wei, W. L. and Jeng, R. J., "Preparation and Thermal Properties of Epoxy-silica Nanocomposites from Nanoscale Colloidal Silica," Polymer, 44, 5159-5167(2003) https://doi.org/10.1016/S0032-3861(03)00519-6
  16. Park, S. J. and Kim, J. S., "Role of Chemically Modified Carbon Black Surfaces in Enhancing Interfacial Adhesion Between Carbon Black and Rubber in a Composite System," J. Colloid Interface Sci., 232, 311(2000) https://doi.org/10.1006/jcis.2000.7160
  17. Petrovigc, Z. S., Jaint, I., Waddon, A. and Banhegyi, G., "Structure and Properties of Polyurethane-silica Nanocomposites," J. Appl. Polym. Sci., 76, 133(2000) https://doi.org/10.1002/(SICI)1097-4628(20000411)76:2<133::AID-APP3>3.0.CO;2-K
  18. Benli, S., Yilmazer, U., Pekel, F. and Ozkar, S., Effect of Fillers on Thermal and Mechanical Properties of Polyurethane Elastomer," J. Appl. Polym. Sci., 68, 1057(1998) https://doi.org/10.1002/(SICI)1097-4628(19980516)68:7<1057::AID-APP3>3.0.CO;2-E
  19. Nunes, R. C. R., Pereira, R. A., Fonseca, J. L. C. and Pereira, M. R., "Polymer-filler Interactions and Mechanical Properties of a Polyurethane Elastomer," Polym. Testing, 19, 93(2000) https://doi.org/10.1016/S0142-9418(98)00075-0
  20. Petrie, E. M., "Epoxy Adhesive Formulations", The McGraw-Hill Companys Inc., New York(2006)