자원리싸이클링 (Resources Recycling)

  • 제18권5호
  • /
  • Pages.44-51
  • /
  • 2009
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  • 2765-3439(pISSN)
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  • 2765-3447(eISSN)
한국자원리싸이클링학회 (The Korean Institute of Resources Recycling)
권호 표지

전자(電子)스크랩에서 구리 및 주석의 회수(回收)를 위한 질산(窒酸) 침출(浸出) 및 침출액(浸出液)에서 유리질산(遊離窒酸) 제거(除去) 연구(硏究)

Nitric acid leaching of electronic scraps and the removal of free nitric acid from the leaching solution for the recovery of copper and tin.

  • 안재우 (대진대학교 신소재공학과) ;
  • 서재성 (대진대학교 신소재공학과)
  • Ahn, Jae-Woo (Dept. of Advanced Materials Sci. & Eng., Daejin University) ;
  • Seo, Jae-Seong (Dept. of Advanced Materials Sci. & Eng., Daejin University)
  • 발행 : 2009.10.27
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초록

전자스크랩중에 함유된 구리 및 주석을 습식공정으로 회수하기 위하여 기초 연구를 실시하였다. 침출제로 질산을 이용하여 분쇄된 전자스크랩에서 구리, 주석, 납, 철 등의 금속 성분들에 대한 침출율을 조사하고 최적 침출조건을 제시 하였다. 이러한 질산 침출 용액으로부터 TBP를 이용하여 유리질산을 분리 추출하여 재활용하기 위한 기초 연구를 실시하였다. 실험 결과 3.0-4.0 M 질산으로 구리를 효과적으로 침출시킬 수 있었으며, 질산 침출액 중 유리질산을 60% TBP에 의해 95%정도 추출이 가능하였고, 유기상에 추출된 질산의 98%를 증류수에 의해 탈거하여 질산침출액으로 재사용이 가능하였다.

Fundamental study has been made on the recovery of copper from the electronic scrap by hydrometallurgical process. Nitric acid was used as a leaching agent to dissolve the metals such as Cu, Sn, Pb, Fe etc. from the crushed electronic scraps. TBP was employed to extract nitric acid from the strong nitric acid leaching solutions and to reclaim nitric acid. From the experimental results, Cu was effectively leached by 3.0-4.0 M nitric acid. And 95% of nitric acid in the leaching solution was extracted by 60% TBP, and 98% of nitric acid was stripped from the loaded organic phase by distilled water and it was possible to reuse as a leaching agent.

키워드

참고문헌

  1. Sum, E. Y. L., 1991: The recover of metal from electronic scrap, JOM, 43(4), pp53-61
  2. Hoffman, J. E., 1992: The recovery of metal from electronic scrap, JOM, 44(7), pp43-48
  3. Andrea Mecucci and Keith Scott, 2002: Leaching and electrochemical recovery of copper, ; lead and tin from scrap printed circuit boards, J. of Chemical Technology and Biotechnology. 77, pp449-457 https://doi.org/10.1002/jctb.575
  4. Maurice C. Fuerstenau, Guoxin Wang, 1997: Selective separation of tin from a chloride leach solution, Hydrometallurgy, 46, pp229-234 https://doi.org/10.1016/S0304-386X(97)00005-4
  5. S. M. Saleh, S. A. Asid and M. S. El-Shahawi, 2001:Extraction and recovery of Au, Sb and Sn from electrorefined solid waste, Analytica Chimica Acta, 436, pp69-77 https://doi.org/10.1016/S0003-2670(01)00866-2
  6. A. Mecucci and K. Scott, 2001: Electrochemical recovery of copper, lead and tin from a nitrate and chloride leaching solution of scrap printed circuit boards, Electrochemical Society Proceedings, 23, pp293
  7. M. A. Rabah, 1998: Combined hydro-pyrometallurgical method for the recovery of high lead/tin/bronze alloy from industrial scrap, Hydrometallurgy, 47, pp281-295 https://doi.org/10.1016/S0304-386X(97)00053-4
  8. Jae-Woo Ahn, Meong-Woon Kim, Jin-Ki Jeong, Jae-Chun Lee, 2006: Recovery Cu and Sn from the bioleaching solution of electronic scrap, J. of Korean Inst. of Resources Recycling, 15(6), pp41-47
  9. Le, Long Hoang, Yoo, Kyong-Keun, Jeong, Jin-Ki, Lee, Jae-Chun, 2008: Leaching of copper and silver from ground mobile phone printed circuit boards using nitric acid, J. of Korean lnst. of Resources Recycling, 17(3), pp48-55
  10. Min-seuk Kim, Jae-chun Lee, Jin-ki Jeong, Byung-su Kim and Eun-young Kim, 2008: Leaching of Copper from Electronic scrap Using Electro-generated Chlorine in Hydrochloric Acid, J. of Korean Inst. of Resources Recycling, 14(5), pp48-55
  11. Jae-Woo Ahn, Myeong-Woon Kim, Jin-Ki Jeong, Jae-Chun Lee, Dong-Gin Kim, Jong-Gwan Ahn, 2005: Biological leaching of Cu, AI, Zn, Ni, Co, Sn and Pb from waste electronic scrap using thiobacillus ferrooxidans, J. of Korean Inst. of Resources Recycling, 14(1), pp17-25
  12. Jae-Woo Ahn, Jin-Ki Jeong, Jae-Chun Lee, Dong Gin Kim, 2005: Bioleaching of valuable metals from electronic scrap using fungi(Aspergillus niger) as a microorganism, J. of Korean Inst. of Resources Recycling, 14(5), pp24-31
  13. Norvell J. Nelson: Regenerative copper etching process and solution, U.S. Patent, 4,545,850
  14. C.J. Brown, D. Davy and P.J. Simmons, 1980: Recovery of nitric acid from solutions used for treating metal surface, Plating and surface finishing, 2, pp60-62
  15. T.K. Mattila, 1977: Nitrate removal from waste solutions by solvent extraction, Ind. Eng. Chem. Process Des. Dev., 16(4), pp469-472 https://doi.org/10.1021/i260064a006
  16. M. Hoshino, 1986: Nitric-hydrofluoric acid recovery process of solvent extraction method, Aromatics, 38(10), pp217-222
  17. Jae-Woo Ahn and Sun-Seob So. 2008: Cementation of tin by aluminium from hydrochloric acid solution, J. of Korean Inst. of Resources Recycling, 17(2), pp70-75
  18. Stefanowicz, T., Napieralska-Zagozda, S. and Osinska, M., 1991: Tin recovery from an electroplating sludge, Resources, Conservation and Recycling, 6, pp61-69 https://doi.org/10.1016/0921-3449(91)90006-A