한국표면공학회지 (Journal of the Korean institute of surface engineering)

  • 제42권1호
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  • Pages.47-52
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  • 2009
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  • 1225-8024(pISSN)
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  • 2288-8403(eISSN)
한국표면공학회 (The Korean Institute of Surface Engineering)
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무전해 도금법을 이용한 코어 셸 구조의 Cu-Ag분말 제조

Preparation of Cu-Ag Powder having Core-Shell Structure by Electroless Plating Method

  • 김종완 (충남대학교 급속응고신소재연구소) ;
  • 이혁희 (한국화학연구원) ;
  • 원창환 (충남대학교 급속응고신소재연구소)
  • Kim, Jong-Wan (Engineering Research Center for Rapidly Solidified Materials, Chungnam National University) ;
  • Lee, Huk-Hee (Korea Research Institute of Chemical Technology) ;
  • Won, Chang-Whan (Engineering Research Center for Rapidly Solidified Materials, Chungnam National University)
  • 발행 : 2009.02.28
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초록

Cu-Ag powder having Core-Shell structure was prepared from by electroless plating method using agents such as $AgNO_3$, $NH_{4}OH$, Hydroquinone. Ag coated copper powders were analyzed using scanning electron microscopy(SEM) and energy dispersive X-ray spectrometer(EDX). The silver coating layer of copper powder was affected from various reaction conditions such as molar ratio of $NH_{4}OH$, $AgNO_3$, and pulp density. Free silver was generated below 0.1M or 0.3M and above of $NH_{4}OH$ mole ratio. Silver coating layer thickened as addition of $AgNO_3$. When the pulp density reached 12% with 0.2M $NH_{4}OH$, and 0.15M $AgNO_3$ at $4^{\circ}C$, silver was homogeneously distributed around the copper particles and free silver particles were not generated.

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참고문헌

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