References
- Sze, S. M., "Pina Technology, 2nd.," Mcgraw-Hill International, p. 184, 1988
- Lee, C. H., Kim, D. H., Lee, N. E. and Kwon, G. C., "Effect of different frequency combination on ArF photoresist deformation and silicon dioxide etching in the dual frequency superimposed capacitively coupled plasmas," Journal of Vacuum Science & Technology A, Vol. 24, No. 4, pp. 1386-1394, 2006 https://doi.org/10.1116/1.2201059
- Kim, Y. S., Lim, H. E., Han, S. H., Lee, Y. H. and Kim, Y. S., "Wettability and Aging Effect of Polystyrene Film Treated by PSII according to the Molecular Weight," Analytical Science & Technology, Vol. 15, No. 3, pp. 229-235, 2002 https://doi.org/10.2116/analsci.15.229
- Cho, J. -H., Kang, B. -K., Kim, K. -S., Choi, B.- K., Kim, S. -H. and Choi, W. -Y., "Hydrophilic Effect of the Polymide by Atmospheric Low-temperature Plasma Treatment," J. of the Korean Institute ofElectrical and Electronic Material Engineers, Vol. 18, No. 2, pp. 148-152, 2005 https://doi.org/10.4313/JKEM.2005.18.2.148
- Lee, E. S., Choi, J. H. and Baik, H. K., "Surface cleaning of indium tin oxide by atmospheric air plasma treatment with the steady-state airflow for organic light emitting diodes," Surface & Coatings Technology, Vol. 201, No. 9-11, pp. 4973-4978, 2007 https://doi.org/10.1016/j.surfcoat.2006.07.202
- Hollander, A. and Behnisch, J., "Low pressure plasma treatments inside a closed package," Surface & Coatings Technology, Vol. 142-144, pp. 1074-1077,2001 https://doi.org/10.1016/S0257-8972(01)01317-2
- Ko, S. K., "Molecular Design and Surface Modification by Ion beam/Plasma Irradiation," Report of Molecular Design and Surface Modification by Ion beam/Plasma Irradiation, pp. 19- 22, 2000
- Kim, N. H., "Studies on the developing metal dry etcher with lower source power," Report of Energy/Resource Technology Development, pp. 10- 16, 2006
- Jiang, W., Xu, X., Dai, Z. -L. and Wang, Y. -N., "Heating mechanisms and particle flow balancing of capacitively coupled plasmas driven by combined dc/rf sources," Physics of Plasmas, Vol. 15, No. 3, pp. 033502-033505, 2008 https://doi.org/10.1063/1.2888516
- Yi, C. H., Jeong, C. H., Lee, Y. H., Ko, Y. W. and Youm, G. Y., "Oxide surface cleaning by an atmospheric pressure plasma," Suface & Coatings Technology, Vol. 177-178, pp. 711-715, 2004 https://doi.org/10.1016/j.surfcoat.2003.08.011
-
Han, S. M., Kim, S. J., Park, J. H., Choi, S. H. and Han, M. K., "High quality nanocrystalline silicon thin film fabricated by inductively coupled plasma chemical vapor deposition at 350
$^{\circ}C$ ," J. of Noncrystalline Solid, Vol. 354, Issues 19-25, pp. 2268- 2271, 2008 https://doi.org/10.1016/j.jnoncrysol.2007.09.082 - Kolobov, V. I., "Fokker-Planck modeling of electron kinetics in plasmas and semiconductors," Computational Materials Science, Vol. 28, Issue 2, pp. 302-320, 2003 https://doi.org/10.1016/S0927-0256(03)00115-0
-
Li, X., Li. L., Hua, X., Oehrlein, G. S., Wang, Y., Vasenkov, A. V. and Kushner, M. J., "Properties of C4F8 inductively coupled plasmas. I. Studies of Ar/c-
$C_4F_8 $ magnetically confined plasmas for etching of$SiO_2$ ," Journal of Vacuum Science & Technology A, Vol. 22, No. 3, pp. 500-510, 2004 https://doi.org/10.1116/1.1697482 - Arslandbekov, R. R. and Kolobov, V. I., "Twodimensional simulations of the transition from Townsend to glow discharge and submormal oscillations," J. of Phys. D: Appl. Phys., Vol. 36, No. 23, pp. 2986-2994, 2003 https://doi.org/10.1088/0022-3727/36/23/020