The Effect of Complexing Agents on the Deposit Characteristics in the Electroless Nickel-Tungsten-Phosphorus Plating

무전해 Ni-W-P 도금에서 착화제의 종류가 피막특성에 미치는 영향

  • Cho, Jin Ki (Deparment of the Advenced Materials Engineering, Korea Polytechnic University) ;
  • Park, Sang Wook (Deparment of the Advenced Materials Engineering, Korea Polytechnic University) ;
  • Kang, Seung Goon (Division of Materials Science Engineering, Hanyang University) ;
  • Son, Seong-Ho (Production Technology Center, KITECH)
  • 조진기 (한국산업기술대학교 신소재공학과) ;
  • 박상욱 (한국산업기술대학교 신소재공학과) ;
  • 강성군 (한양대학교 신소재 공학부) ;
  • 손성호 (한국생산기술연구원)
  • Received : 2008.05.01
  • Published : 2008.11.25

Abstract

Deposition characteristics of electroless plated Ni-W-P films were investigated for various complexing agents. Used complexing agents are sodium citrate, sodium gluconate and sodium malonate. In this study, the existing mixed potential theory could explain the overall mechanism of Ni-W-P electroless plating for all complexing agents. The deposition rate could be also expected by the theory. The deposited Ni-W-P films were evaluated in term of surface hardness and corrosion resistance. Microhardness of the deposit increased about 1,000 Hv after heat treatment for one hour at $400^{\circ}C$, because it was above the crystallization temperature of $Ni_3P$. The deposited Ni-W-P films can exhibit excellent corrosion resistance in using sodium malonate as a complexing agent, the other hand the using sodium gluconate was the worst corrosion resistance. The worst corrosion resistance was due to a large number of nano-sized pin-holes or small pores. The plating current at the mixed potential increases when the using sodium malonate as a complexing agent, it was explained by the cross section.

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References

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