대한금속재료학회지 (Korean Journal of Metals and Materials)

  • 제46권1호
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  • Pages.33-38
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  • 2008
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  • 1738-8228(pISSN)
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  • 2288-8241(eISSN)
대한금속재료학회 (The Korean Institute of Metals and Materials)
권호 표지

전해 도금된 주석 솔더 범프의 계면 반응과 전단 강도에 미치는 UBM의 효과

Effect of Under Bump Metallization (UBM) on Interfacial Reaction and Shear Strength of Electroplated Pure Tin Solder Bump

  • 김유나 (성균관대학교 신소재공학부) ;
  • 구자명 (성균관대학교 신소재공학부) ;
  • 박선규 (성균관대학교 사회환경시스템공학과) ;
  • 정승부 (성균관대학교 신소재공학부)
  • Kim, Yu-Na (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Koo, Ja-Myeong (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Park, Sun-Kyu (School of Civil and Environmental Engineering, Sungkyunkwan University) ;
  • Jung, Seung-Boo (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
  • 투고 : 2007.10.09
  • 발행 : 2008.01.22
⟨ 이전 논문 다음 논문 ⟩

초록

The interfacial reactions and shear strength of pure Sn solder bump were investigated with different under bump metallizations (UBMs) and reflow numbers. Two different UBMs were employed in this study: Cu and Ni. Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) were formed at the bump/Cu UBM interface, whereas only a Ni3Sn4 IMC was formed at the bump/Ni UBM interface. These IMCs grew with increasing reflow number. The growth of the Cu-Sn IMCs was faster than that of the Ni-Sn IMC. These interfacial reactions greatly affected the shear properties of the bumps.

키워드

과제정보

연구 과제 주관 기관 : 산업자원부

참고문헌

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