Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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A Study on Pad Profile Variation using Kinematical Analysis on Swing Arm Conditioner

스윙 암 컨디셔너의 기구학적 해석을 통한 CMP 패드 프로파일 변화에 관한 연구

  • 오지헌 (부산대학교 기계공학과 정밀기계공학 CMP LAB.) ;
  • 이상직 (부산대학교 기계공학과 정밀기계공학 CMP LAB.) ;
  • 이호준 (부산대학교 기계공학과 정밀기계공학 CMP LAB.) ;
  • 조한철 (부산대학교 기계공학과 정밀기계공학 CMP LAB.) ;
  • 이현섭 (부산대학교 기계공학과 정밀기계공학 CMP LAB.) ;
  • 김형재 (한국생산기술연구원 초정밀복합가공팀) ;
  • 정해도 (부산대학교 기계공학과 정밀기계공학 CMP LAB.)
  • Published : 2008.11.01
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Abstract

There are many factors to affect polishing performance normally in chemical mechanical polishing (CMP) process. One of the factors is a pad profile. A pad profile has not been considered as a significant factor. However, a pad profile is easily changed by conditioning process in CMP, and then changed pad profile affects polishing performance. Therefore, understanding how the pad profile is changed by conditioning process is very important. In this paper, through the simulation based on kinematic analysis, the variation of the pad profile was described in accordance with difference condition of conditioning process. A swing-arm type conditioner was applied in this simulation. A swing-arm type conditioner plays a role of generating asperities on pad surface. The conditions of conditioing process to get uniform removal were also investigated by comparing the simulation with the experiment.

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References

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