Study on recovery of $Na_{2}SiF_6$ and acetic acid from waste acid produced during semiconductor wafer process

반도체 웨이퍼 제조공정(製造工程) 중 발생불산(發生廢酸)으로부터 $Na_{2}SiF_6$ 및 초산의 회수(回收)에 관한 연구(硏究)

  • Kim, Hyun-Sang (R&D center, NIT Co., Ltd. R&D center, Daeil Development Co., Ltd.) ;
  • Kim, Ju-Yup (Dept. of civil engineering, Hanyang University) ;
  • Lee, Hyang-Sook (R&D center, NIT Co., Ltd. R&D center, Daeil Development Co., Ltd.) ;
  • Shin, Chang-Hoon (R&D center, NIT Co., Ltd. R&D center, Daeil Development Co., Ltd.) ;
  • Kim, Jun-Young (R&D center, NIT Co., Ltd. R&D center, Daeil Development Co., Ltd.) ;
  • Bae, Woo-Keun (Dept. of civil engineering, Hanyang University) ;
  • Ahn, Jong-Kwan (Korea Institute of Geoscience and Mineral Resources)
  • Published : 2008.10.27

Abstract

We researched recycle of mixed waste acids including HF, $CH_{3}COOH$, $HNO_3$ produced during semiconductor wafer process. At first, we recovered HF in form of $Na_{2}SiF_6$ by precipitation using $NaNO_3$ and $Na_{2}SiO_3$. Concentration of HF was made down from 110 g/L, initial concectration, to 0.5 g/L and Recovery rate of HF was 99.5%. After recovery of HF, concentration of $HNO_3$ and $CH_{3}COOH$ is 498 g/L, 265 g/L respectively. From that mixed acid, we recovered $CH_{3}COOH$ using 2 stages of fractional distillation. In first stage, $CH_{3}COOH$ was distilled for separation from $HNO_3$. And in second stage, we recoverd refined $CH_{3}COOH$ by using fractional distillation for removing a little amount of $HNO_3$ in $CH_{3}COOH$ vapor. The concentration of recovered $CH_{3}COOH$ in second stage is 20% and finally recovery rate of $CH_{3}COOH$ is about 87.5%.

반도체 웨이퍼 제조 공정 중 발생하는 질산, 불산, 초산으로 구성된 혼산을 재활용하기 위한 연구를 수행하였다 초기에 $NaNO_3$$Na_{2}SiO_3$를 사용하여 불산을 $Na_{2}SiF_6$로 침전시켜 회수하였고, 이 때 혼산 중 불산의 농도는 초기 110g/L에서 0.5g/L로 낮아져 불산 회수율은 99.5%였다. 불산회수 후 남은 혼산의 질산과 초산의 농도는 각각 498g/L, 265g/L였고, 이 혼산을 2단계 분별증류 법에 의해 분리 회수하였다. 1단계에서는 초산을 증류하여 질산과 분리해내고, 2단계에서는 증류된 초산 중 잔류하는 미량의 질산을 제거하여 순수 초산만을 회수하였다. 회수된 초산의 농도는 약 20%였고, 최종회수율은 약 87.5%이었다.

Keywords

References

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