Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 15 Issue 3
- /
- Pages.9-17
- /
- 2008
- /
- 1226-9360(pISSN)
- /
- 2287-7525(eISSN)
Contact Resistance of the Flip-Chip Joints Processed with Cu Mushroom Bumps
Cu 머쉬룸 범프를 적용한 플립칩 접속부의 접속저항
- Park, Sun-Hee (Department of Materials Science and Engineering, Hongik University) ;
- Oh, Tae-Sung (Department of Materials Science and Engineering, Hongik University)
- Published : 2008.09.30
Abstract
Cu mushroom bumps were formed by electrodeposition and flip-chip bonded to Sn substrate pads. Contact resistances of the Cu-mushroom-bump joints were measured and compared with those of the Sn-planar-bump joints. The Cu-mushroom-bump joints, processed at bonding stresses ranging from 19.1 to 95.2 MPa, exhibited contact resistances near
전기도금법으로 Cu 머쉬룸 범프를 형성하고 Sn 기판 패드에 플립칩 본딩하여 Cu 머쉬룸 범프 접속부를 형성하였으며, 이의 접속저항을 Sn planar 범프 접속부와 비교하였다.