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Fabrication of LTCC Multi-layer Circuit Board made of Glass-Al2O3 Composites

Glass-Al2O3 복합소재를 원료로 한 LTCC 다층회로 기판의 제조

  • 곽훈 (동의대학교 나노공학과) ;
  • 전형도 (동의대학교 나노공학과) ;
  • 김환 (동의대학교 나노공학과) ;
  • 이원재 (동의대학교 나노공학과) ;
  • 신병철 (동의대학교 나노공학과) ;
  • 김일수 (동의대학교 나노공학과)
  • Published : 2008.06.01

Abstract

Multi-layer circuit card for semiconductor inspection was fabricated by LTCC technology. After a proper impedance design without electrical interference, ceramic tapes with the composition of $CaO-Al_2O_3-SiO_2-B_2O_3$ glass and $Al_2O_3$ were prepared. The electrode with silver paste printed on the tape. Printed ceramic sheets were then laminated and sintered. Densities and dielectric properties were measured. The microstructure, fracture surface of the region of via and matching state of substrate-electrode were observed. The durability of plated outside electrode were examined by hardness and scratch test.

Keywords

References

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