한국분말재료학회지 (Journal of Powder Materials)

  • 제15권3호
  • /
  • Pages.221-226
  • /
  • 2008
  • /
  • 2799-8525(pISSN)
  • /
  • 2799-8681(eISSN)
한국분말재료학회 (*구 분말야금학회) (The Korean Powder Metallurgy & Materials Institute)
권호 표지
DOI QR코드

DOI QR Code

무전해 도금법을 이용한 전자소재용 은-구리 복합분말의 제조

Synthesis of Ag-Cu Composite Powders for Electronic Materials by Electroless Plating Method

  • 윤치호 (한국지질자원연구원 자원활용소재연구부) ;
  • 안종관 (한국지질자원연구원 자원활용소재연구부) ;
  • 김동진 (한국지질자원연구원 자원활용소재연구부) ;
  • 손정수 (한국지질자원연구원 자원활용소재연구부) ;
  • 박제신 (한국지질자원연구원 자원활용소재연구부) ;
  • 안양규 (건양대학교 대학원 화학과)
  • Yoon, C.H. (Minerals and Material Processing Division, Korea Institute of Geosciences and Mineral Resources(KIGAM)) ;
  • Ahn, J.G. (Minerals and Material Processing Division, Korea Institute of Geosciences and Mineral Resources(KIGAM)) ;
  • Kim, D.J. (Minerals and Material Processing Division, Korea Institute of Geosciences and Mineral Resources(KIGAM)) ;
  • Sohn, J.S. (Minerals and Material Processing Division, Korea Institute of Geosciences and Mineral Resources(KIGAM)) ;
  • Park, J.S. (Minerals and Material Processing Division, Korea Institute of Geosciences and Mineral Resources(KIGAM)) ;
  • Ahn, Y.G. (Department of chemistry, Konyang University)
  • 발행 : 2008.06.28
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

Silver coated copper composite powders were prepared by electroless plating method by controlling the activation and deposition process variables such as feeding rate of silver ions solution, concentration of reductant and molar ratio of activation solution $(NH_4OH/(NH_4)_2SO_4)$ at room temperature. The characteristics of the product were verified by using a scanning electron microscopy (SEM), X-ray diffraction (XRD) and atomic absorption (A.A.). It is noted that completely cleansing the copper oxide layers and protecting the copper particles surface from hydrolysis were important to obtain high quality Ag-Cu composite powders. The optimum conditions of Ag-Cu composite powder synthesis were $NH_4OH/(NH_4)_2SO_4$ molar ratio 4, concentration of reductant 15g/l and feeding rate of silver ions solution 2 ml/min.

키워드

참고문헌

  1. K. S. Yun, Y. C. Park, B. S. Yang, H. H. Min and C. W. Won: J. Korean Powder Metall. Inst., 12 (2005) 56 (Korean) https://doi.org/10.4150/KPMI.2005.12.1.056
  2. S. Y. Park, T. W. Yoon, C. H. Lee, I. B. Jeong and S. H. Hyun: Powder Metall. World Congress, (2006) 1076
  3. V. Privman, D. V. Goia, J. S. Park and E. Matijevic: J. Colloid Interface Sci., 213 (1999) 36 https://doi.org/10.1006/jcis.1999.6106
  4. Y. T. Yu and Y. Y. Choi: Kor. J. Mater. Res., 13 (2003) 524 https://doi.org/10.3740/MRSK.2003.13.8.524
  5. Y. M. Park, H. H. Jin, S. R. Kim, H. C. Park and S. Y. Yoon: Kor. J. Mater. Res., 14 (2004) 790 https://doi.org/10.3740/MRSK.2004.14.11.790
  6. A. M. Litman, D. M. Staggs and N. E. Fowler: Technical papers, Regional Tech. Conf (1982) 127
  7. D. Russev, D. Raclev, S. Kava: J. Met. Finish. 81 (1983) 27
  8. N. Koto, J. Yukawa and T. Moro: US Patent No. 4,652,465 (1987)
  9. T. Hayashi: US Patent No. 5,178,909 (1993)
  10. X. Xu, X. Luo, H. Zhuang, W. Li and B. Zhang: Mat. Letter., 57 (2003) 3987 https://doi.org/10.1016/S0167-577X(03)00252-0