Journal of the Korean Society for Heat Treatment (열처리공학회지)

The Korean Society for Heat Treatment (한국열처리공학회)
권호 표지

Effects of Annealing Treatments on Microstructure and Mechanical Property of co-sputtered TiNi Thin Film

Co-sputtering에 의해 증착된 TiNi 박막의 미세조직 및 기계적성질에 미치는 어닐링 열처리 효과

  • Park, S.D. (Department of Advanced Materials Engineering, Chungbuk National University) ;
  • Baeg, C.H. (Department of Advanced Materials Engineering, Chungbuk National University) ;
  • Hong, J.W. (Department of Advanced Materials Engineering, Chungbuk National University)
  • 박수대 (충북대학교 공과대학 신소재공학과) ;
  • 백창현 (충북대학교 공과대학 신소재공학과) ;
  • 홍주화 (충북대학교 공과대학 신소재공학과)
  • Received : 2007.12.17
  • Accepted : 2008.01.24
  • Published : 2008.01.31
Download PDF
⟨ Previous Next ⟩

Abstract

Effects of annealing treatment on microstructure and mechanical property of co-sputtered TiNi thin films were studied. As-deposited films showed amorphous state. However, above annealing temperature of $500^{\circ}C$ martensite phase (B19'), precipitate phase ($Ti_2Ni$) and a small amount of parent phase ($B_2$) were present, and phase transformation behaviors were three multi-step phase transformations $B19^{\prime}{\rightarrow}B_2$ and $B_2{\rightarrow}R-phase$ and $R-phase{\rightarrow}B19^{\prime}$. Increase of martensite transformation temperature, increase of microhardness and Young's modulus of TiNi films annealed above $500^{\circ}C$ were discussed in terms of precipitate phase.

Keywords

References

  1. I. Otsuka : Shape Memory Alloys, Cambridge University Press, New York (1998) 1
  2. T. W. Duering, K. N. Melton, D. Stockel, and C. M. Wayman : "Engineering Aspects of Shape Memory Alloys", Butterworth-Heinemann Ltd, London (1990) 11
  3. A. Gyobu, Y. Kawamura, H. Horikawa and T. Saburi : Mater. Trans., JIM, 37 (1996) 697 https://doi.org/10.2320/matertrans1989.37.697
  4. J. D. Busch and A. D. Johnson : J. Appl. Phys., 68 (1990) 6224 https://doi.org/10.1063/1.346914
  5. Yong-Feng Lu, Xiao-Yu Chen, Zhong-Min Ren, Sha Zhu, Jian-ping Wang, Thomas Y. F. Liew : Jpn. J. Appl. Phys. 40 (2001) 5329 https://doi.org/10.1143/JJAP.40.5329
  6. J. L. He, K. W. Won and J. T. Chang : Thin Solid Films, 359 (2000) 46 https://doi.org/10.1016/S0040-6090(99)00720-8
  7. Sneddon : Int. J. Eng. Sci., 3 (1965) 47 https://doi.org/10.1016/0020-7225(65)90019-4
  8. F. J. Gadieu and N. Chencinski : IEEE Trans. Magn., 227 (1975) 11
  9. J. A. Thornton : J. Vac. Sci. Technol., 11 (1974) 666 https://doi.org/10.1116/1.1312732
  10. X. G. Tang, H. R. Zeng, A. L. Ding, P. S. Qiu, W. G. Luo, H. Q. Li and D. Mo : Solid State Commun., 116 (2000) 507 https://doi.org/10.1016/S0038-1098(00)00349-5
  11. T. Kikuchi, K. Ogawa, S. Kajiwara, T. Matsunaga, S. Miayzaki and Y. Tomota : Philos. Mag. A78(2) (1998) 467