Journal of the Korean Society of Industry Convergence (한국산업융합학회 논문집)
- Volume 11 Issue 4
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- Pages.171-175
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- 2008
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- 1226-833X(pISSN)
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- 2765-5415(eISSN)
A Study on the Development of FPCB Lamination Press
FPCB 열압착 프레스 개발에 관한 연구
- An, Jae-Woo (School of Mechanical Engineering, KIT) ;
- Lee, Chang-Heon (School of Mechanical Engineering, KIT) ;
- Byun, Jae-Hyuk (School of Mechanical Engineering, KIT) ;
- Lee, Jong-Hyung (School of Mechanical Engineering, KIT)
- 안재우 (금오공과대학교 대학원 생산기계공학과) ;
- 이창헌 (금오공과대학교 대학원 생산기계공학과) ;
- 변재혁 (금오공과대학교 대학원 생산기계공학과) ;
- 이종형 (금오공과대학교 기계공학부)
- Received : 2008.05.09
- Accepted : 2008.11.21
- Published : 2008.11.30
Abstract
The bigger size of the wafer to the meet the need of higher productivity and the smaller digital products for convene are examples of the main trends of the market among others. The higher integrity of chips is also an important task in semiconductor industry. In this thesis the COF(chop on film) technology has reviewed to investigate the best combinations of required functions and to develop a new system to save the installation area and to adapt to the variation of layout with flexibility. The new system shows the better and provides the improved safety with smaller size.