자외선 레이저를 이용한 건식디캡슐레이션에 관한 연구

A Study on dry decapsulation by Using a UV Laser

Decapsulation technology is useful to inspect EMC of package device and the etching technology enable to check inside of device by removing plastic molding. Chemical etching method is used widely to fabricate a lot of semiconductor. But the method has some disadvantage due to wet process. Proposed method in this paper shows the application possibility such as fast processing time, processing accuracy and dry process. These result was obtained by directly removing of packed EMC using UV laser.