Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging

Optoelectronic 패키징을 위한 Au-Sn 플립칩 범핑 기술과 신뢰성

  • 윤정원 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) ;
  • 김종웅 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) ;
  • 구자명 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) ;
  • 노보인 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) ;
  • 정승부 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
  • Published : 2008.02.28
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References

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