Korean Chemical Engineering Research

The Korean Institute of Chemical Engineers (한국화학공학회)
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Effect of MeOH/IPA Ratio on Coating and Fluxing of Organic Solderability Preservatives

유기 솔더 보존제의 코팅 및 플럭싱에 대한 메탄올/이소프로필알콜 비율의 영향

  • Lee, Jae-Won (School of Applied Chemistry and Biological Engineering, Chungnam National University) ;
  • Kim, Chang Hyeon (Daedeok Research Institute, Honam Petrochemical Co.) ;
  • Lee, Hyo Soo (Nano Material Team, Advanced Material Center, Korea Institute of Industrial Technology) ;
  • Huh, Kang Moo (School of Applied Chemistry and Biological Engineering, Chungnam National University) ;
  • Lee, Chang Soo (School of Applied Chemistry and Biological Engineering, Chungnam National University) ;
  • Choi, Ho Suk (School of Applied Chemistry and Biological Engineering, Chungnam National University)
  • Received : 2008.01.23
  • Accepted : 2008.02.10
  • Published : 2008.04.30
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Abstract

Recent popularity in mobile electronics requires higher standard on the mechanical strength of electronic packaging. Thus, the method of soldering between chip and substrate in electronic packaging process is changing from conventional method using intermetallic compound to a new method using organic solderability preservative (OSP) in order to improve the stability and the reliability of final product. Since current organic solder preservatives have several serious problems like thermo-stability during packaging process, however, it is necessary to develop new OSPs having thermo-stability. The main purpose of this study is to investigate the effect of MeOH/IPA (Isopropyl alcohol) ratio on the fluxing of a new OSP, developed in previous research, andto find out an optimum formulation of flux components for the application of the OSP in current packaging process. As a result of this study, it was revealed that higher MeOH/IPA ratio in flux showed better performance of fluxing a new OSP.

최근 모바일 전자 제품의 많은 사용으로 인하여 전자 기판의 기계적 충격에 대한 기준이 강화되고 있다. 따라서, 전자 기판의 패키징 공정에서 칩과 기판 간의 솔더 볼의 접합방법은 제품의 안정성과 신뢰성 확보를 위하여 기존의 금속간 화합물을 사용하는 방식에서 유기 솔더 보존제를 사용하는 방법으로 전환되고 있다. 그러나 기존의 유기 솔더 보존제들은 공정상에서의 열안정성 등의 여러 가지 단점이 발견되어 이를 보완하기 위한 새로운 유기 솔더 보존제의 개발이 요구되고 있다. 이전 연구에서 새로 개발된 유기 솔더 보존제를 기존 패키징 공정에 적용(플럭싱 공정에 적용)할 때, 사용되는 플럭스의 성분비(메탄올/이소프로필알콜)에 따른 플럭싱의 차이를 파악하고, 이를 통하여 새로운 유기 솔더 보존제에 적합한 플럭스를 포뮬레이션 하는 것을 목적으로 하고 있다. 연구 결과, 새로운 유기 솔더 보존제의 플럭싱에는 메탄올의 함량비가 높아질수록 플럭싱이 더 우수해지는 경향을 나타내었다.

Keywords

Acknowledgement

Supported by : 산업기술평가원

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