Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 15 Issue 4
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- Pages.31-39
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- 2008
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Cap Formation Process for MEMS Packages using Cu/Sn Rim Bonding
Cu/Sn Rim 본딩을 이용한 MEMS 패키지의 Cap 형성공정
- Kim, S.K. (Department of Materials Science and Engineering, Hongik University) ;
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Oh, T.S.
(Department of Materials Science and Engineering, Hongik University) ;
- Moon, J.T. (SOP Technology Team, IT Convergence & Components Laboratory(ICCL) Electronics and Telecommunications Research Institute)
- Published : 2008.12.31
Abstract
To develop the MEMS cap bonding process without cavity formation, we electroplated Cu/Sn rim structures and measured the bonding characteristics for the Cu/Sn rims of
캐비티 형성이 불필요한 MEMS 캡 본딩을 위해 전기도금법을 이용하여 Cu/Sn rim 구조를 형성하였으며,