Transactions of the Korean Society of Mechanical Engineers A (대한기계학회논문집A)

The Korean Society of Mechanical Engineers (대한기계학회)
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Nano-level High Sensitivity Measurement Using Microscopic Moiré Interferometry

마이크로 무아레 간섭계를 이용한 초정밀 변형 측정

  • 주진원 (충북대학교 기계공학부) ;
  • 김한준 (충북대학교 대학원 기계공학과)
  • Published : 2008.02.05
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Abstract

[ $Moir{\acute{e}}$ ] interferometry is an optical method, providing whole field contour maps of in-plane displacements with high resolution. The demand for enhanced sensitivity in displacement measurements leads to the technique of microscopic $moir{\acute{e}}$ interferometry. The method is an extension of the $moir{\acute{e}}$ interferometry, and employs an optical microscope for the required spatial resolution. In this paper, the sensitivity of $moir{\acute{e}}$ interferometry is enhanced by an order of magnitude using an immersion interferometry and the optical/digital fringe multiplication(O/DFM) method. In fringe patterns, the contour interval represents the displacement of 52 nm per fringe order. In order to estimate the reliability and the applicability of the optical system implemented, the measurements of rigid body displacements of grating mold and the coefficient of thermal expansion(CTE) for an aluminium block are performed. The system developed is applied to the measurement of thermal deformation in a flip chip plastic ball grid array package.

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References

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