Transactions of the Korean Society of Mechanical Engineers A (대한기계학회논문집A)

The Korean Society of Mechanical Engineers (대한기계학회)
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A Novel Tensile Specimen and Tensile Tester for Mechanical Properties of Thin Films

박막의 기계적 물성을 위한 새로운 인장 시편 및 인장 시험기

  • 박준협 (동명대학교 메카트로닉스공학과) ;
  • 김윤재 (고려대학교 기계공학과)
  • Published : 2007.06.01
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Abstract

Mechanical property evaluation of micrometer-sized structures is necessary to help design reliable microelectromechanical systems(MEMS) devices. Most material properties are known to exhibit dependence on specimen size and such properties of microscale structures are not well characterized. This paper describes techniques developed for tensile testing of thin film used in MEMS. Epi-polycrystalline silicon is currently the most widely used material, and its tensile strength has been measured as 1.52GPa. We have developed a tensile testing machine for testing microscale specimen using electro-magnetic actuator. The field magnet and the moving coil taken from an audio-speaker were utilized as the components of the actuator. Structure of specimen was designed and manufactured for easy handling and alignment. In addition to the static tensile tests, it is described that new techniques and procedures can be adopted for high cycle fatigue test of a thin film.

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References

  1. Johansson, S., Schweitz, J. A., Tenez, L. and Tiren, J., 1988, 'Fracture Testing of Silicon Micro-Elements in Situ in a Scanning Electron Microscope,' J. Appl. Phys. 62 (10), pp. 4799-4803 https://doi.org/10.1063/1.340471
  2. Komai, K., Minoshima, K., Tawara, H., Inoue, S. and Sunako, K., 1994, 'Development of Mechanical Testing Machine for Micro-Elements and Fracture Strength Evaluaion of Single-Crystalline Sislicon Micro-Elements,' Trans. Jpn. Sco., Mech. Eng. A 60- 569, pp. 52-58
  3. Bromley, E. I., Randall, J.N., Flanders, D.C. and Mountain, R.W., 1983, 'A Techniqu for the Determination of Stress in Thin-Films,' J. Vac. Sci. Technol. B 1 (4), pp. 1364-1366 https://doi.org/10.1116/1.582744
  4. Tabata, O., Kawashata, K., Sugiyama, S. and Igarashi, I., 1989, 'Mechanical Property Measurement of Thin-Films Using Load-Deflection of Composite Rectangular Membrane,' in:Proceedings of the IEEE Micro-Electro Mechanical Systems Workshop, pp. 152-156
  5. Sharpe Jr., W.N., Yuan, B., Vaidyanathan, R. and Edwards, R. L., 1997, 'Measurement of Young's Modulus, Poisson's Ratio, and Tensile Strength of Polysilicon,' in:Proceedings of the IEEE MEMS '97, pp. 424-429
  6. Tsuchiya, T., Tabata, O., Sakata, J. and Taga, Y., 1997, 'Specimen Size Effect on Tensile Strength of Surface Micro-Machined Polycrystalline Silicon Thin-Films,' in:Proceedings of the IEEE MEMS '97, pp. 529-534
  7. Cunningham, S.J., Suwito, W. and Read, D.T., 1995, 'Tensile Testing of Epitaxial Silicon Films,' Technical Digests of Transducers '95, pp. 96-99
  8. Jones, R. V., 1951, 'Parallel and Rectilinear Spring Movements,' Journal of Scientific Instrumentationk, 28, pp. 38-41 https://doi.org/10.1088/0950-7671/28/2/303
  9. Mohamed Gad-El-Hak, 2001, The MEMS handbook, CRC press

Cited by

  1. Fatigue Limit of Copper Film vol.33, pp.10, 2009, https://doi.org/10.3795/KSME-A.2009.33.10.1158