Composites Research

The Korean Society for Composite Materials (한국복합재료학회)
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Superhydrophobic Engineered Surface Based on Nanohoneycomb Structures

나노허니컴 구조물을 이용한 산업용 극소수성 표면 제작

  • 김동현 (포항공과대학교 기계공학과) ;
  • 박현철 (포항공과대학교 기계공학과) ;
  • 이건홍 (포항공과대학교 화학공학과) ;
  • 황운봉 (포항공과대학교 기계공학과)
  • Published : 2007.04.30
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Abstract

Superhydrophobic polytetrafluoroethylene ($Teflon^{(R)}$, Dupont) sub-micro and nanostructures were fabricated by the dipping method, based on anodization process in oxalic acid. The polymer sticking phenomenon during the replication creates the sub-microstructures on the negative polytetrafluoroethylene nanostructure replica. This process gives a hierarchical structure with nanostructures on sub-microstructures, which looks like the same structures as lotus leaf and enables commercialization. The diameter and the height of the replicated nano pillars were 40 nm and 40 um respectively. The aspect ratio is approximately 1000. The fabricated surface has a semi-permanent superhydrophobicity, the apparent contact angle of the polytetrafluoroethylene sub-micro and nanostructures is about $160^{\circ}$, and the sliding angle is less than $1^{\circ}$.

Oxalic acid를 이용한 양극산화기법과 테플론 담금법을 이용하여 극소수성 나노/마이크로 구조물을 복제하였다. 이때 nanoscale hole의 사이즈는 양극산화시의 전압과 양극산화시간에 의해 결정된다. nanoscale에서 분자들 사이에 영향을 미치는 Van der Waals interactions에 의해서 복제 중 polymer sticking 현상이 발생한다. 이는 복제된 나노 구조물들이 서로 들러붙고 구부러지고 침강시키는 작용을 하게 된다. 이러한 현상이 microstructures위에 nanostructures가 존재하는 hierarchical structure가 생성되게 하며, 이러한 구조물은 연꽃잎의 미세구조물과 유사한 특성을 보인다. 즉 제작된 극소수성 나노/마이크로 구조물 표면은 접촉각이 $160^{\circ}{\sim}170^{\circ}$정도로 나타내고 또한 $1^{\circ}$미만의 sliding angle을 나타낸다.

Keywords

References

  1. Young T., Philosophical Transaction of the Royal Society of London, Vol. 95, 1805, pp. 65-87
  2. Wenzel RN., J. Phys. Colloid Chern., Vol. 53, 1949, pp. 1466 https://doi.org/10.1021/j150474a015
  3. Cassie A.B.D., Baxter S., Trans. Faraday Soc., Vol. 40, 1944, pp. 546 https://doi.org/10.1039/tf9444000546
  4. Johnson R.E., Dettre R.H., Adv. Chern. Ser., Vol. 43, 1964, pp. 112
  5. Marmur A., Langmuir, Vol. 20, 2004, pp. 3517-3519 https://doi.org/10.1021/la036369u
  6. Barthlott W., Neinhuis C, Planta, Vol. 202, 1997, pp. 1-8 https://doi.org/10.1007/s004250050096
  7. Zhai L., Cebeci F. C., Cohen R. E., and Rubner M. F., Nano Letters, Vol. 4, No.7, 2004, pp. 1349-1353 https://doi.org/10.1021/nl049463j
  8. Furstner R. and Barthlott W., Lanmuir, Vol. 21, 2005, pp. 956-961 https://doi.org/10.1021/la0401011
  9. Kim J., Kim C.-J, IEEE Conf. MEMS, Las Vegas, NV, Jan. 2002, pp. 479-482
  10. Sun M., Luo C., Xu L.; Ji H., Ouyang Q., Yu D., Chen Y., Langmuir, Vol. 21, 2005, pp. 8978-8981 https://doi.org/10.1021/la050316q
  11. Bico J., Tordeux C., Quere D., Europhys. Lett., Vol. 55, 2001, pp. 214 https://doi.org/10.1209/epl/i2001-00402-x
  12. Bico J., Marzolin c., Quere D., Europhys. Lett., Vol. 47, 1999, pp. 220 https://doi.org/10.1209/epl/i1999-00548-y
  13. Tadanaga K., Morinaga J., Matsuda A., Minami T., Chern. Mater., Vol.12, 2000, pp. 590-592 https://doi.org/10.1021/cm990643h
  14. Oner D., McCarthy T.J., Langmuir, 2000, 16, 7777-7782 https://doi.org/10.1021/la000598o
  15. Youngblood J.P., McCarthy T.J., Macromolecules, Vol. 32, 1999, pp. 6800-6806 https://doi.org/10.1021/ma9903456
  16. Chen W., Fadeev A.Y., Hsieh M.C., Oner D., Youngblood J.P.; McCarthy T.J., Langmuir, Vol. 15, 1999, pp. 3395-3399 https://doi.org/10.1021/la990074s
  17. Redon R., Olmos A.V., Zamora M.E.M., Medrano A.O., Torres F.R., Saniger J.M., J. Colloid and Interface Sci., Vol. 287, 2005, pp. 664-670 https://doi.org/10.1016/j.jcis.2005.02.036
  18. Feng L., Song Y., Zhai J., Liu B., Xu J., Jiang L., Zhu D., Angew. Chern. Int. Ed., Vol. 42, 2003, pp. 800-802 https://doi.org/10.1002/anie.200390212
  19. Ramos S.M.M., Charlaix E., Benyagoub A., Surface Science, Vol. 540, 2003, pp. 355-362 https://doi.org/10.1016/S0039-6028(03)00852-5
  20. Ramos S.M.M., Charlaix E., Physical Review E, Vol. 67, 2003, pp. 031604 https://doi.org/10.1103/PhysRevE.67.031604
  21. Liu H., Feng L., Zhai J., Jiang L., Zhu D., Langmuir, Vol. 20, 2004, pp. 5659-5661 https://doi.org/10.1021/la036280o
  22. Hemmerle J., Roucoules V., Fleith G., Nardin M., Ball V., Lavalle Ph., Marie P., Voegel J.-C., Schaaf P., Langmuir, Vol. 21, 2005, pp. 10328-10331 https://doi.org/10.1021/la052157g
  23. Jiang. Y., Wang Z., Yu X., Shi F., Xu H., Zhang X., Langmuir, Vol. 21, 2005, pp. 1986-1990 https://doi.org/10.1021/la047491b
  24. Kanai N., Nuida T., Ueta K., Hashimoto K., Watanabe T., Ohsaki H., Vacuum, Vol. 74, 2004, pp. 723-727 https://doi.org/10.1016/j.vacuum.2004.01.056