Polymer Science and Technology (한국고분자학회지:고분자과학과기술)
- Volume 18 Issue 6
- /
- Pages.542-548
- /
- 2007
- /
- 1225-0260(pISSN)
- /
- 2586-1476(eISSN)
Thermal Interface Materials in Electronic packages Using Thermal Conducting Properties of Carbon Nanotubes
탄소나노튜브의 열적 특성과 이를 이용한 전자패키지용 Thermal Interface Material 개발 동향
- Lee, Jung-Sub (Department of Materials Science and Engineering, KAIST) ;
-
Jeon, Duk-Young
(Department of Materials Science and Engineering, KAIST)
- Published : 2007.12.26
Abstract
Keywords