Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 14 Issue 1
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- Pages.33-38
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- 2007
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Failure in the COG Joint Using Non-Conductive Adhesive and Polymer Bumps
감광성 고분자 범프와 NCA (Non-Conductive Adhesive)를 이용한 COG 접합에서의 불량
- Ahn, Kyeong-Soo (Div. of Advanced Materials Science Engineering, Hanyang University) ;
- Kim, Young-Ho (Div. of Advanced Materials Science Engineering, Hanyang University)
- Published : 2007.03.30
Abstract
We studied a bonding at low temperature using polymer bump and Non-Conductive Adhesive (NCA), and studied the reliability of the polymer bump/Al pad joints. The polymer bumps were formed on oxidized Si substrates by photolithography process, and the thin film metals were formed on the polymer bumps using DC magnetron sputtering. The substrate used was AL metallized glass. The polymer bump and Al metallized glass substrates were joined together at
본 실험에서는 Non-Conductive Adhesive (NCA) 와 고분자 범프를 이용한 COG (Chip-on-glass) 접합에 대하여 연구하였다. 산화막이 증착된 Si 기판 위에 고분자 범프를 사진식각 방법으로 형성하고, 고분자 범프 위에 직류 마그네트론 스퍼터링 방법으로 금속 박막층을 증착하였다. 기판으로는 Al을 증착한 유리기판을 사용하였다. 두 종류의 NCA를 사용하여