Korean Chemical Engineering Research

The Korean Institute of Chemical Engineers (한국화학공학회)
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Effect of Added Supercritical CO2 on the Characteristics of Copper Electroless Plating on PET Film Substrate

PET 필름기재의 구리 무전해도금에 있어서 초임계 CO2 유체가 도금 특성에 미치는 영향

  • Lee, Hee-Dai (Department of Chemical Engineering, Sungkyunkwan University) ;
  • Kim, Moon-Sun (Department of Chemical Engineering, Sungkyunkwan University) ;
  • Kim, Chul kyung (Department of Design & Materials, Mokwon University)
  • 이희대 (성균관대학교 화학공학과) ;
  • 김문선 (성균관대학교 화학공학과) ;
  • 김철경 (목원대학교 디자인소재학과)
  • Received : 2006.12.28
  • Accepted : 2007.05.07
  • Published : 2007.08.31
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Abstract

In this study, electroless plating of copper was performed on PET film by using the blend of supercritical $CO_2$ and plating solution. The optimum volumetric ratio of supercritical fluid and plating solution was found to be 1:9 and dispersion property was poor at $CO_2$ vol% langer than 10%. Electroless plating of copper was best at $25^{\circ}C$ and 15 MPa. Role of added supercritical $CO_2$ is not to increase solubility but to disperse and maintain Cu-particles as the 1st particles.

본 연구는 $CO_2$ 초임계 유체를 도금액과 혼합하여 PET 필름 위에 무전해 구리도금을 실시하였으며 초임계 유체의 혼용조건에 따른 그 도금 효과를 비교하였다. 이산화탄소 초임계 유체와 도금액의 부피비는 1:9가 최적이였으며 초임계 유체가 10 vol% 이상이 되면 혼합액의 분산성이 불량해져 층분리가 발생하였다. 구리 무전해도금은 $25^{\circ}C$, 15 MPa 에서 수행된 구리막의 표면물성이 가장 균일하였다. 무전해 구리도금에서 도금액과 혼합시킨 초임계 유체의 역할은 단순히 용해도를 높여 주는 것이 아니라 도금막을 구성하는 구리입자를 1차 입자상태로 분산, 유지시킴을 확인하였다.

Keywords

References

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