인쇄 회로 기판의 Retum Current Plane용 Via-Hole의 분포량 및 간격에 따른 EMI 설계 지침

References

1. S. Asanee, K. Arash, and A. Ramesh, 'Using via fences for crosstalk reduction in PCB circuit', 2006 IEEE Electromagnetic Compatibility Symposium, pp. 34-37, 2006
2. R. F. German, H. Ott, and C. R. Paul, 'Effect of an image plane on PCB radiation', Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, New York, 1990
3. M. I. Montrose, 'Overview of design techniques for printed circuit board layout used in high technology product', Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, New York, 1991
4. CKC Lab, EMI Considerations for High Speed System Design, 1991
5. R. W. Dockey, R. F. German, 'New techniques for reducing printed circuit board common-mode radiation', Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, New York, pp. 334-339, 1993
6. H. Ott, Noise Reduction Techniques in Electronic System, 2nd., John Wiley & Sons, New York, 1988
7. H. Johnson, M. Graham, High-Speed Signal Propagation : Advanced Black Magic, Prentice Hall, 2003
8. David M. Pozar, Microwave Engineering, John Wiley & Sons, Inc
9. M. I. Montrose, EMC and the Printed Circuit Board : Design Theory, and Layout made Simple, John Wiley & Sons, Inc
10. K. L. Kaiser, Electromagnetic Compatibility Handbook, CRC Press, pp. 16-14-16-42, 2004