Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
권호 표지
DOI QR코드

DOI QR Code

Effect of Dispersant on the Characterization of Cu Powders Prepared with Wet-reduction Process

액상-환원법으로 합성된 Cu 분말의 특성에 미치는 분산제의 영향

  • Kim, Yong-Yee (School of Materials Science and Engineering, Pusan National University) ;
  • Kim, Tea-Wan (School of Materials Science and Engineering, Pusan National University) ;
  • Park, Hong-Chae (School of Materials Science and Engineering, Pusan National University) ;
  • Yoon, Seog-Young (School of Materials Science and Engineering, Pusan National University)
  • Published : 2007.01.27
Download PDF
⟨ Previous Next ⟩

Abstract

Ultra-fine Copper powder for a conductive paste in electric-electronic field have been synthesized by chemical reduction of aqueous $CuSO_4$ with hydrazine hydrate $(N_2H_4{\cdot}H_2O)$ as a reductor. The effect of reaction conditions such as dispersant and reaction temperature on the particle size and shape for the prepared Cu powders was investigated by means of XRD, SEM, TEM and TGA. Experiments showed that type of dispersant and reaction temperature were affected on the particle size and morphology of the copper powder. When the carboxymethyl cellulose (CMC) was added as a dispersant the relative mono-dispersed and spherical Cu powder was obtained. Cu powders with particle size of approximately 140nm and narrow particle size distribution were obtained from 0.3M $CuSO_4$ with adding of 0.03M CMC and 40ml $N_2H_4{\cdot}H_2O$ at a reaction temperature of $70^{\circ}C$.

Keywords

References

  1. V. Privman, D. V. Goia, J. S. Park and E. Matijevic, J. of Colloid and Interf. Sci., 213, 36-45 (1999) https://doi.org/10.1006/jcis.1999.6106
  2. Y. T. Yu and Y. Y Choi, Kor. J. Mater. Res., 13(8), (2003) https://doi.org/10.1557/JMR.1998.0001
  3. Q. Wnag, H. Yang, J. Shi and G. Zou, Mater. Sci. and Eng., A307, 190 (2001) https://doi.org/10.1016/S0921-5093(00)01966-3
  4. X. Zhu, R. Birringer, U. Herr and H. Gleiter, Phys. Rev., B35, 9085 (1987) https://doi.org/10.1103/PhysRevB.35.9085
  5. A. R. Yavri, Mater. Trans. JIM, 36, 228 (1995) https://doi.org/10.2320/matertrans1989.36.228
  6. C. Suryanarayana, Processing and properties of Nano crystalline Materials, TMS, Warendale, PA (1996)
  7. S. Ayyappan, G. N. Subbanna, R. Srinivasa Gopalan and C. N. R. Rao, Solid State lonies, 84(3-4), 271 (1996) https://doi.org/10.1016/0167-2738(96)00021-5
  8. K. H. Kim, Y. B. Lee, E. Y. Choi, H. C. Park and S. S. Park, Mater. Chem. and Phys., 86, 420 (2004) https://doi.org/10.1016/j.matchemphys.2004.04.011
  9. S. M. Llett, A. Orroek, W. C. K. Poon, and P. N. Pusey, Phys. Rev., E51, 1334 (1995)
  10. W. C. K. Poon, J. S. Selfe, M. B. Robertson, S. M. Llett. A. D. Pirie and P. N. Pusey, J. de Physique II, 3(7), 1075 (1993) https://doi.org/10.1051/jp2:1993184
  11. A. Biffis, A. A. D'Archivio, K. Jerabek, G. Schumid and B. Corain: Adv. Mater., 12, 1909 (2000)
  12. M. Li and G. L. Messing, in Ceramic powder Science Ⅲ, American Ceramic Society, Westerville., 129 (1990)