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Bare Wafer Inspection using a Knife-edge Test

  • 투고 : 2007.08.31
  • 발행 : 2007.12.25

초록

We present a very simple and efficient bare-wafer inspection method using a knife-edge test. The wafer front surface and inner structures are inspected simultaneously. The wafer front surface is inspected visually using a knife-edge test while the inner structure is simultaneously inspected by a camera in the infrared region with a single white-light source. This paper presents a laboratory implementation of the test method with some experimental results.

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참고문헌

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