The Journal of Korean Institute of Electromagnetic Engineering and Science (한국전자파학회논문지)

The Korean Institute of Electromagnetic Engineering and Science (한국전자파학회)
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An Unequal Wilkinson Power Divider Using Defected Ground Structure in Double Layered Substrate

이중 기판 결함 접지 구조를 이용한 비대칭 월킨슨 전력 분배기

  • Lim, Jong-Sik (Department of Electrical and Communication Engineering, Soonchunhyang University) ;
  • Koo, Jae-Jin (Department of Electrical and Communication Engineering, Soonchunhyang University) ;
  • Oh, Seong-Min (Department of Electrical and Communication Engineering, Soonchunhyang University) ;
  • Jeong, Yong-Chae (Depatment of Electronic and Information Engineering, Chonbuk National University) ;
  • Ahn, Dal (Department of Electrical and Communication Engineering, Soonchunhyang University)
  • 임종식 (순천향대학교 전기통신공학과) ;
  • 구재진 (순천향대학교 전기통신공학과) ;
  • 오성민 (순천향대학교 전기통신공학과) ;
  • 정용채 (전북대학교 전자정보공학부) ;
  • 안달 (순천향대학교 전기통신공학과)
  • Published : 2007.11.30
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Abstract

A novel 1:4 unequal wilkinson power divider using rectangular-shaped defected ground structure(DGS) in double layered substrate is proposed for removing the ground problem of DGS in packaging. Rectangular-shared DGS produces the transmission line having much higher characteristic impedance than standard microstrip line. The proposed unequal divider is composed of DGS and double layered substrate in order to be free from the ground problem of DGS patterns in packaging in metal housings. The second substrate is attached to the first substrate which contains DGS pattern on its ground plane at the bottom side to form the double layered substrate. In order to show the validity of the proposed DGS in the double layered substrate, a 1:4 unequal power divider is designed and measured. The predicted and measured performances are shown with an excellent agreement between them.

종래의 DGS를 이용한 초고주파 회로의 메탈 패키징(metal packaging)시 존재했던 DGS의 접지면 접촉 문제를 해결하고자, 본 논문에서는 이중 기판 결함 접지 구조 구조를 제안하고, 이를 1:4 비대칭 전력 분배기에 적용한 응용예를 제시한다. 이중 기판에 구현된 사각형 DGS는 종래와 같이 마이크로스트립 선로의 특성 임피던스를 표준형 선로보다 크게 증가시킨다. 이중 기판 DGS 구조를 형성하기 위하여 제2유전체 기판이 DGS가 구현된 기판면의 바닥 접지면에 접합된다. 따라서 제2유전체 기판이 메탈 패키지 바닥면에 장착되므로, DGS가 직접 패키지 접촉되는 것을 막을 수 있다. 초고주파 회로 응용예를 보이기 위해, 이중 기판 DGS를 이용하여 패키지 접지 문제를 해결한 1:4 비대칭 전력 분배기의 설계 및 측정 결과가 제시되는데, 시뮬레이션과 측정 결과에 있어서 잘 일치하는 특성을 보인다.

Keywords

References

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