Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Resolution and Adhesion Properties of Solder Resist for Printed Circuit Board

인쇄회로기판용 solder resist의 해상성과 밀착력

  • 최성호 (인하대학교 신소재공학부) ;
  • 황성진 (인하대학교 신소재공학부) ;
  • 김형순 (인하대학교 신소재공학부)
  • Published : 2007.12.31
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Abstract

According to progress rapidly digitalization, networked and mobilization of electronics industry, there are demands for being smaller, thinner, more light, and more efficient complex functions of electronic devices which are wireless devices, semi-conductors, packages and mobile devices. Therefore, the solder resist on a printed circuit board have been required with the high resolution and the eco-friendly materials in the surface treatments such as high heating process and coating process with electrolysis. In this study, the photoinitiator initiator and monomers of the solder resist were prepared with their contents for reducing the occurrence of the under-cut. We investigated the sample surface by UV/VIS spectrometer, FT-IR, OM after HASL and ENIG process. From our results, it is possible to get a high adhesion of resist with optimal contents between the photoinitiator initiator and monomers after surface treatments.

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References

  1. D. J. Lee, K. K. Lee and Y. J. Se, Kor. J. Foundrymen's Soc., 17(3), 245 (1997)
  2. H. L. John, W. R. Donald and A. A. Phil, IEEE Transactions on Components, Hybrids and ManufacturingTechnology, CHMT-10(3), 346 (1987)
  3. J. J. Park, J. W. Park, S. H. Park, J.M. Park, T.K. Kuenand S.K. Kim, Kor. J. Academy Conservative Dentistry,27(2), 158 (2002)
  4. C. F. Coombs, Printed circuits handbook, 3rd ed., p. 8,McGraw-Hill, New York, (1979)
  5. W. B. Lee, K. S. Bang, Y. M. Yeun, S. B. Jung, Kor. J.Welding & Joining Soc., 20(5), 87 (2002)
  6. F. Williams, in Proceedings of the Radtech Europe conference (Barcelona, Spain, Oct. 2005). ed. F. Williams(Radtech Europe, Hannover, Germany, 2005) p. 531
  7. G. Webster, Chemistry & Technology of UV & EB formulation for Coatings, inks & paints, Vol II, 2nd ed., p.276, SITA Technology, Wiley, New York, (1996)
  8. G. Webster, Chemistry & Technology of UV & EB formulation for Coatings, inks & paints, Vol VI, 2nd ed.,p. 90, SITA Technology, London, (1991)
  9. P. P. Ray, Surface Mount Technology: principles and practice, p. 180, Chapman & Hall, New York, (1997)
  10. D. J. Lee, K. K. Lee, J. J. Lee, Kor. J. Institute of Metals,34(5), 603 (1996)