반실험적 열소산 방법을 이용한 위성용 전장품 열해석

A SATELLITE ELECTRONIC EQUIPMENT THERMAL ANALYSIS USING SEMI-EMPERICAL HEAT DISSIPATION METHOD

  • 김정훈 (한국항공우주연구원 통신해양기상위성사업단 체계종합그룹) ;
  • 전형열 (한국항공우주연구원 통신해양기상위성사업단 체계종합그룹) ;
  • 양군호 (한국항공우주연구원 통신해양기상위성사업단 체계종합그룹)
  • 발행 : 2006.06.01

초록

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is considered instead of conventional lumped capacity nodes. These modeling methods are applied to the thermal design and analysis of CTU EM and EQM and verified by thermal cycling and vacuum tests.

키워드

참고문헌

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